Silicon chip cutting device

Abstract

A silicon wafer cutting device, including an upper bracket, a fixed table, a cylinder, and a cutting knife; the upper bracket is arranged above the fixed table, and two slide rails are arranged on the upper bracket, and the two slide rails are connected to each other. Parallel, the cylinder is horizontally arranged between the two slide rails, the telescopic end of the cylinder is vertically arranged below the upper bracket, and the end of the telescopic end close to the fixed table is horizontally provided with a push plate, The bottom of the push plate is longitudinally provided with a connecting rod, and the bottom of the connecting rod is fixed with a cutting knife fixing frame, and the cutting knife is arranged in the cutting knife fixing frame; a positioning cutting groove is horizontally arranged on the fixing platform. The beneficial effects of the present invention are as follows: (1) the cutting device can cut a single silicon chip at one time, avoiding back and forth cutting, resulting in damage to the silicon chip and irregularity of the edge of the silicon chip; (2) the fixed table is equipped with The positioning of the cutting groove avoids the deviation of the silicon wafer during cutting and reduces the waste of cost.

Description

technical field [0001] The invention belongs to the technical field of solar battery sheet preparation, and in particular relates to a silicon wafer cutting device. Background technique [0002] The process flow of solar panel production is slicing→cleaning→preparing suede→peripheral etching→removing the PN+ junction on the back→making upper and lower electrodes→making anti-reflection film→sintering→testing→grading. Among them, slicing is the process of cutting silicon rods into silicon wafers. In the cutting process, if the cutting is not accurate, there will be deviation during cutting, which will lead to low cutting efficiency, resulting in unnecessary waste and production. The cost is high; at the same time, for a single silicon wafer, if it cannot be cut successfully at one time and needs to be cut back and forth, it will cause unnecessary damage to the silicon wafer. Contents of the invention [0003] The object of the present invention is to provide a silicon wafer...

AI Technical Summary

Problems solved by technology

Among them, slicing is the process of cutting silicon rods into silicon wafers. In the cutting process, if the cutting is not accurate, there will be deviation during cutting, which will lead to low cutting efficiency, resulting in unnecessary waste and production. High cost; at the same time, for a single silicon wafer, if it cannot be cut successfully at one time and needs to be cut back and forth, it will cause unnecessary damage to the silicon wafer

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