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Pouring method of epoxy resin AB glue in jewelry manufacturing

A technology of epoxy resin and pouring method, which is applied in the direction of epoxy resin glue, jewelry, clothing, etc., and can solve problems such as easy formation of bubbles, white spots of jewelry, and influence on appearance

Inactive Publication Date: 2017-11-03
CHINA UNIV OF GEOSCIENCES (WUHAN)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the related technology, air bubbles are easy to form during the pouring process, causing white spots to form on the jewelry and affecting the appearance

Method used

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  • Pouring method of epoxy resin AB glue in jewelry manufacturing
  • Pouring method of epoxy resin AB glue in jewelry manufacturing

Examples

Experimental program
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Effect test

Embodiment 1

[0019] Refer to attached figure 1 , the embodiment of the present invention provides a kind of pouring method of epoxy resin AB glue in jewelry making, comprises the following steps:

[0020] (1) Weigh component A and component B of epoxy resin AB glue into a clean container, and stir in the same direction at the same time; stirring in the same direction is conducive to the combination of small bubbles generated during the stirring process into larger bubbles and escape;

[0021] Wherein, the weight ratio of component A to component B is 3:1-1.5, and the composition and mass parts of said component A are: 80-100 parts of bisphenol A epoxy resin, 20 parts of bisphenol F epoxy resin ~40 parts, 5~15 parts of nano-scale silica / epoxy polymer toughening agent, 20~60 parts of filler, the composition of the B component is: 90~100 parts of polyetheramine, 5 parts of amino-terminated polyether ~10 parts, accelerator 1~2 parts; stirring time is 30s~60s; too long stirring time will easi...

Embodiment 2

[0027] Refer to attached figure 2 , the embodiment of the present invention provides a kind of pouring method of epoxy resin AB glue in jewelry making, comprises the following steps:

[0028] (1) Weigh components A and B in proportion to a clean container, and stir in the same direction at the same time;

[0029] (2) Put the above mixed AB glue into another clean container, stir and mix evenly in the same direction;

[0030] (3) Take the uniformly mixed AB component and pour or smear it on the jewelry, and use a needle or toothpick to move the air bubbles formed during the pouring or smearing until the air bubbles leave the jewelry surface;

[0031] (4) The jewelry after pouring is solidified at room temperature until it is formed;

[0032] (5) The molded jewelry is baked at a temperature of 250°C to 280°C for 1s to 3s. All the other are the same as embodiment one.

[0033] After the cured jewelry is damp in the environment and forms white spots, it can be baked at high t...

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Abstract

The invention discloses a pouring method of epoxy resin AB glue in jewelry manufacturing, which comprises the steps of uniformly stirring and mixing a component A and a component B of the epoxy resin AB glue, pouring an obtained mixture on the jewelry or smearing the obtained mixture on the surface; bubbles generated in the pouring or smearing process can be slightly touched by a hand sewing needle or toothpick, then the bubbles can automatically disappear after being removed from the surface of the jewelry, so that the situation that white spots are formed in the molded jewelry is avoided; white spots formed on the cured and molded jewelry due to the factors of humidity and the like can be removed through heating under high temperature; the process is simple and easy to operate, and the problem that the white spots influences the appearance of the jewelry is solved; the epoxy resin AB glue is adopted, so that the dainty and exquisite of the jewelry is enhanced, and the visual effect of the jewelry is improved.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a pouring method of epoxy resin AB components in jewelry making. Background technique [0002] Epoxy resin adhesive (epoxy resin adhesive) generally refers to the adhesive made of epoxy resin as the main body. The epoxy resin and its diluent and various auxiliary components are called A glue. Large, generally need to be dispersed at a high speed in a stirring disperser. The curing agent part is called B glue, and the viscosity is generally small, so there is no need to use a stirring disperser. pouring. In the related art, air bubbles are easily formed during the pouring process, resulting in the formation of white spots on the jewelry and affecting the appearance. Contents of the invention [0003] In view of this, the embodiment of the present invention provides a casting method of epoxy resin AB glue that can effectively remove air bubbles and white spots in jewe...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/08C09J11/04A44C27/00
CPCA44C27/00C08K2201/011C08L2205/025C08L2205/03C08L2205/06C09J11/04C09J11/08C09J163/00C08L63/00C08K3/36
Inventor 卢筱张宗蕊
Owner CHINA UNIV OF GEOSCIENCES (WUHAN)
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