Fingerprint module and manufacturing method thereof
The technology of a fingerprint module and manufacturing method is applied in the directions of acquiring/arranging fingerprints/palmprints, character and pattern recognition, instruments, etc., and can solve the problems that are not conducive to enhancing the market competitiveness of products, high production costs, and low production efficiency. Achieve the effects of shortening the production cycle, reducing production costs and improving production efficiency
Pending Publication Date: 2017-11-03
广东星星电子科技有限公司
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Problems solved by technology
[0005] The process is difficult and the process is complicated
In addition, the single-grain processing method has low production efficiency, long production cycle and high production cost, which is not conducive to enhancing the market competitiveness of products
Method used
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[0035] Below, the present invention will be further described in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of not conflicting, the various embodiments described below or the technical features can be combined arbitrarily to form new embodiments. .
[0036] Please refer to figure 1 The fingerprint module provided by the embodiment of the present invention includes a fingerprint chipset 10 and a protective layer 20, the protective layer 20 is a transparent adhesive layer or an ink layer, and a color dry film layer 30 is arranged between the fingerprint chipset 10 and the protective layer 20, The fingerprint chipset 10 includes a fingerprint sensor 11 and a plastic seal layer 12, the plastic seal layer 12 faces the user during use, the two sides of the color dry film layer 30 are bonded with the protective layer 20 and the plastic seal layer 12 respectively, and the two sides of the color dry film la...
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The present invention discloses a fingerprint module, which comprises a fingerprint chip group and a protection layer. The protection layer is a transparent layer or an ink layer. A color dry film layer is arranged between the fingerprint chip group and the protection layer. The two surfaces of the color dry film layer are respectively connected with the plastic sealing layers of the protection layer and the fingerprint chip group. Before the connection process, a release film is adhered to each of the two surfaces of the color dry film layer. The invention further provides a manufacturing method of the fingerprint module. The manufacturing method of the fingerprint module includes the following steps of attaching the plastic sealing layer of the fingerprint chip group to the color dry film layer to form a first fingerprint chip module; spraying the protection layer on the surface of the color dry film layer of the first fingerprint chip module to form a second fingerprint chip module; and cutting the second fingerprint chip module into single particle fingerprint modules. Based on the fingerprint module, no color layer is sprayed on the surface of the plastic sealing layer of the fingerprint chip group, so that the manufacturing process is simplified. The manufacturing period is shorted and the manufacturing cost is lowered. The market competitiveness of products is improved.
Description
technical field [0001] The invention relates to touch screen technology, in particular to a fingerprint module and a manufacturing method thereof. Background technique [0002] At present, in the field of touch screen technology, fingerprint recognition has the characteristics of high uniqueness, high stability, high accuracy, and high security. Therefore, fingerprint recognition is widely used in the field of touch screen technology, and the market potential is huge. [0003] In the prior art, the fingerprint module of the Coating scheme generally adopts the following process when making the color layer and protective layer on the surface: first cut the large fingerprint chip set into individual chips according to the required size, and then separate the chips on the single chip. The surface of the plastic sealing layer is processed by at least two spraying and baking processes to form a color layer, and then a protective layer is coated on the surface of the color layer. ...
Claims
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Login to View More IPC IPC(8): G06K9/00G06F3/041
CPCG06F3/041G06V40/1306
Inventor 杨文涛许宁李喜荣吴刚
Owner 广东星星电子科技有限公司