Thin composite circuit board

Abstract

The invention discloses a thin composite circuit board comprising a flexible circuit board, and a first rigid circuit board and a second rigid circuit board arranged on the upper and lower surfaces of the flexible circuit board, wherein the flexible circuit board comprises a flexible dielectric layer, and a first circuit layer and a second circuit layer arranged on the upper and lower surfaces of the flexible dielectric layer; the first rigid circuit board comprises a first rigid dielectric layer and a third circuit layer arranged on the first rigid dielectric layer, the first rigid dielectric layer comprises a first rigid dielectric part and a second rigid dielectric part arranged at two ends of the flexible circuit board at intervals, so that a part of the first circuit layer is exposed outwards, the third circuit layer comprises a first main circuit arranged on the outer surface of the first rigid dielectric part and a first external circuit arranged on the outer surface of the second rigid dielectric part, a plurality of first connection holes are formed in the first rigid dielectric layer on the outer side of the first circuit layer, and a plurality of second connection holes are formed in the second rigid dielectric layer on the outer side of the second circuit layer. According to the thin composite circuit board provided by the invention, the technical problem that the composite circuit board cannot be thin is solved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, and more specifically, the invention relates to a thin composite circuit board. Background technique [0002] In the field of circuit boards, composite circuit boards are usually used to connect two rigid substrates. The structure of the soft board is to achieve the connection between the soft board and the hard board by embedding part of its peripheral area in the hard board. This structure can not only improve the connection reliability between the hard board and the soft board, but also save the subsequent production of the soft board. The process steps of the rigid board connection structure and increase the transmission speed. [0003] Existing composite circuit boards for carrying and electrically connecting multiple electronic components are mainly composed of multiple circuit layers and multiple dielectric layers laminated alternately. These circuit layers are defined and formed ...

AI Technical Summary

Problems solved by technology

[0006] Another object of the present invention is to provide a thin composite circuit board, which uses the method of reserving connection holes in the rigid circuit layer to reserve a buffer depth for the conductive through holes. When the punching depth reaches the upper end of the connection hole and connects When the punching process is stopped, the overshoot or undershoot phenomenon can be avoided without increasing the thickness of the composite circuit board, and the technical problem that the composite circuit board cannot be thinned is solved.

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