Electroless copper plating method on the surface of rigid pmi foam integrated waveguide

A technology of surface chemistry and integrated waveguide, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of poor bonding with plastic substrates, etc., and achieve strong bonding, high purity of plating, and electrical conductivity Good results

Active Publication Date: 2019-09-20
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In order to overcome the problem of poor bonding between the existing plastic surface electroless copper plating method and the plastic substrate, the present invention provides a kind of rigid PMI foam integrated waveguide surface electroless copper plating method

Method used

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  • Electroless copper plating method on the surface of rigid pmi foam integrated waveguide

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The density of the good PMI rigid foam of processability selected by the present embodiment is 70Kg / m 3 .

[0022] Step 1, set the density to 70Kg / m 3 The advanced PMI foam is processed, engraved, polished, and the whole hole.

[0023] Step 2: Measure and weigh the size of the foam and soak it in absolute ethanol for 5 minutes, then wash it.

[0024] Step 3. Soak the cleaned foam in 1.8g / L sodium hydroxide and 1.8g / L anhydrous sodium carbonate aqueous solution for 5 minutes to roughen it, take it out, wash it, and then place it in a sulfuric acid aqueous solution with a concentration of 10ml / L for 10 minutes , take out and wash.

[0025] Step 4. Put the roughened foam into the activation solution for 1.5h activation. After palladium metal particles are attached to the surface, take out the degumming and wash it.

[0026] Step 5. Dissolve 2g of anhydrous copper sulfate, 3g of ethylenediaminetetraacetic acid, and 3g of potassium sodium tartrate in 200ml of deionized w...

Embodiment 2

[0031] The density of the good PMI rigid foam of processability selected by the present embodiment is 110Kg / m 3 .

[0032] Step 1. Set the density to 110Kg / m 3 The advanced PMI foam is processed, engraved, polished, and the whole hole.

[0033] Step 2: Measure and weigh the size of the foam and soak it in absolute ethanol for 5 minutes, then wash it.

[0034] Step 3. Soak the cleaned foam in 2.25g / L sodium hydroxide and 2.0g / L anhydrous sodium carbonate aqueous solution for 7 minutes to roughen, take it out, wash it, and then place it in a sulfuric acid aqueous solution with a concentration of 10ml / L for 10 minutes , take out and wash.

[0035] Step 4. Put the roughened foam into the activation solution for 1.5h activation. After palladium metal particles are attached to the surface, take out the degumming and wash it.

[0036] Step 5. Dissolve 2g of anhydrous copper sulfate, 3g of ethylenediaminetetraacetic acid, and 3g of potassium sodium tartrate in 200ml of deionized w...

Embodiment 3

[0041] The density of the good PMI rigid foam of processability selected in this embodiment is 200Kg / m 3 .

[0042] Step 1. Set the density to 200Kg / m 3 The advanced PMI foam is processed, engraved, polished, and the whole hole.

[0043] Step 2. Foam surface cleaning: Measure the size of the foam, weigh it, soak it in absolute ethanol, soak it for 5 minutes, and wash it.

[0044] Step 3. Soak the cleaned foam in 2.5g / L sodium hydroxide and 2.5g / L anhydrous sodium carbonate aqueous solution for 10 minutes to roughen, take it out, wash it, and then place it in a concentration of 10ml / L sulfuric acid aqueous solution for 10 minutes. Take it out and wash it.

[0045] Step 4. Put the roughened foam into the activation solution for 1 hour activation. After palladium metal particles are attached to the surface, take out the degumming and wash it.

[0046] Step 5. Dissolve 8g of anhydrous copper sulfate, 12g of ethylenediaminetetraacetic acid, and 12g of potassium sodium tartrate ...

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Abstract

The invention discloses a rigid polymethacrylimide (PMI) foam integrated waveguide surface electroless copper plating method. The rigid PMI foam integrated waveguide surface electroless copper plating method is used for solving the technical field of the poor binding force of copper and a plastic substrate of an existing plastic surface electroless copper plating method. The technical scheme is that the rigid PMI foam integrated waveguide surface electroless copper plating method adopts polymethacrylimide foam of different densities as a substrate, and processing and hole conditioning, cleaning, surface roughening, activating, electroless copper plating and plating layer anti-corrosion treatment are conducted on the polymethacrylimide foam. According to the rigid PMI foam integrated waveguide surface electroless copper plating method, because the high-strength high-heat-resistance rigid PMI foam is adopted as a waveguide structure, compared with the prior art, the size and weight of antennas are reduced, and limit of shapes of the antennas do not influence on the polymethacrylimide foam; because a electroless copper plating technology is adopted, surface metallization can be conducted on waveguide structures of through holes and complicated shapes well, a plating layer is even, the plating layer does not need to be covered with a metal plate, and a gap influencing on performance does not exist; and the electroless copper plating technology adopts a one-step activation method and activating solutions using-repeatedly, waste of palladium metal is avoided, the plating layer is thick, the conductibility is good, and the binding force of the plating layer and the plastic substrate is high.

Description

technical field [0001] The invention relates to a method for electroless copper plating on the surface of plastics, in particular to a method for electroless copper plating on the surface of a rigid PMI foam integrated waveguide. Background technique [0002] With the development needs of light weight, miniaturization, high density and high integration of electronic devices and equipment in aerospace and shipbuilding fields, the use of organic polymer materials has become an inevitable trend. Among them, all kinds of waveguide products in microwave technology are metal parts. They have large weight and volume, high cost and complicated processing technology, which are difficult to meet the urgent needs of airborne radar, satellite communication equipment and other fields for weight reduction. Polymethacrylimide (PMI) foam is a lightweight, cross-linked, rigid structural foam with a mass of 32-400Kg / m 3 The range of controllable density, high strength, modulus and creep resi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/40C23C18/30C23C18/22
Inventor 张广成王爱峰史学涛姚瑶
Owner NORTHWESTERN POLYTECHNICAL UNIV
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