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Semiconductor air conditioner module

A semiconductor and air-conditioning technology, applied in the field of air-conditioning devices, can solve the problems of difficulty in modularization, difficulty in long-distance blowers, and difficulty in recycling heat at the hot end, and achieves the effect of a wide range of applications.

Pending Publication Date: 2017-11-07
ZHEJIANG GEMCORE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this technical solution can make full use of the cooling and heating functions of the semiconductor refrigeration sheet, it is difficult to recycle the heat generated at the hot end during the cooling process of the air conditioner, and it is also necessary to cool the heat at the hot end; Among them, the blower is difficult to refrigerate for a long distance, and the water cooling structure cannot be used in the structure; it is difficult to realize modularization in the structure, and it is impossible to carry out various installations and combinations in the process of production and use.

Method used

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  • Semiconductor air conditioner module
  • Semiconductor air conditioner module
  • Semiconductor air conditioner module

Examples

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Embodiment Construction

[0028] like figure 1 , 2 , 3 shows that the first preferred embodiment of the present invention is mainly composed of a box body 1, a cold guide plate 2, a fixed plate 3, a cover plate 4, a cold guide fin 5, a first semiconductor refrigerating sheet 6, and a first uniform temperature plate 7. Second vapor chamber 8, thermoelectric power generation chip 9, third vapor chamber 10, second semiconductor cooling plate 11, radiator 12, water pump 13, exchanger 14, blower 15, filter screen 16, cooling pipe 17 , antifreeze storage cold night 18 and other components. Wherein, the cold end of the first semiconductor refrigeration sheet 6 is fixed with a cold-conducting plate 2, and the surface of the cold-conducting plate 2 is fixed with a cooling-conducting fin 5, and the cooling-conducting fin 5 is located inside the box body 1, and the surface of the box body 1 is provided with At least two interfaces. In this embodiment, the above-mentioned interface is connected with a cooling p...

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Abstract

A semiconductor air conditioner module comprises a box, semiconductor refrigerating sheets and coldness guide plates. The semiconductor air conditioner module is characterized in that the cold ends of the semiconductor refrigerating sheets are fixedly provided with the coldness guide plates, the surface of the coldness guide plates are fixedly provided with coldness accumulation structures and / or coldness guide fins, the coldness accumulation structures and the coldness guide fins are located in the box, and the surface of the box is provided with at least two connectors. The semiconductor air conditioner module can adopt an air cooling manner or a water cooling manner, and especially the water cooling manner is suitable for long-distance refrigeration conveyance; or the air cooling manner and the water cooling water are adopted at the same time, when the distance is short, the air cooling structure is adopted, and when the distance is long, the water cooling structure is used for refrigeration conveyance.

Description

technical field [0001] The present invention relates to an air conditioner, especially a kind of cooling by semi-conductor refrigerating sheet, which adopts various methods such as cold storage structure and cooling fins, and performs air conditioning through air-cooling or water-cooling, and can control the temperature generated by the semi-conductor refrigerating sheet. An air conditioning module that recovers heat and generates electricity. Background technique [0002] Traditional air conditioners generally use a compressor structure. After decades of development, its structure has been further improved and improved. Its maturity and reliability have also enabled it to be widely used in the market. But it also has many shortcomings, such as the risk of leakage of the refrigerant medium (freon), not environmentally friendly, high power consumption, thermal pollution and noise. With the development of technology, especially the rapid development of semiconductor technolog...

Claims

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Application Information

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IPC IPC(8): F24F5/00H02N11/00
CPCH02N11/002F24F5/0042
Inventor 诸建平
Owner ZHEJIANG GEMCORE TECH
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