Special cooler for CPU and manufacture method thereof

Abstract

The invention discloses a special cooler for a CPU and a manufacture method thereof. The cooler comprises a protective frame, a turbo fan, and aluminum heat conduction sheets, wherein connecting stalks are arranged at the periphery of the protective frame; a control box is arranged at one side outside the protective frame; the control box is internally provided with a controller; a micro-converter is arranged below the controller; the bottom of the control box is provided with a power access end; the protective frame is internally provided with the turbo fan; the turbo fan is internally connected with a rotary disk; the rotary disk is internally connected with an inverter motor; a sealing sleeve is connected below the protective frame; the bottom of the sealing sleeve is provided with the aluminum heat conduction sheets; a temperature sensor is arranged in the center of the aluminum heat conduction sheets; and a silicon sucker is arranged at the bottoms of the aluminum heat conduction sheets. The cooler has the advantages of good cooling effect and accurate feedback temperature, in addition, the cooler has the advantages of being easy to manufacture and convenient to install, being low-cost and having high tightness.

Description

technical field [0001] The invention belongs to the technical field of processor heat dissipation equipment, and in particular relates to a special radiator for a microprocessor and a processing method thereof. Background technique [0002] The microprocessor (CPU) is the core component of the computer. It has a history of more than 30 years since its initial development. People's work and life are constantly updated with it. The development of computers is mainly manifested in the development of its CPU. Whenever a new type of CPU appears, it will drive the corresponding development of other components of the computer system, such as the further optimization of computer architecture and the continuous increase of memory access capacity. , The continuous improvement of access speed, the continuous improvement of peripheral equipment and the continuous emergence of new equipment. [0003] With the rapid development of the computer industry, the integration of the CPU is incr...

AI Technical Summary

Problems solved by technology

Compared with other forms of heat dissipation, the air-cooled radiator has its own irreplaceable importance, and it is very convenient to disassemble and assemble, but it is highly dependent on the environment. For example, its heat dissipation performance will be greatly affected when the temperature rises and overclocking

[0006] 2. Liquid-cooled heat dissipation, the market share is also constantly increasing. In addition to being stronger than air-cooled radiators in terms of heat dissipation performance, there is another prominent advantage, that is, quietness, liquid cooling performance is stable during the heat dissipation process, and the impact The main reason for its widespread use is that the price is much higher than that of air-cooled radiators. In addition, liquid-cooled radiators generally have a disadvantage, that is, they are easy to leak

However, most of the commonly used processor heat sinks on the market have the disadvantages of ineffective heat dissipation and inaccurate temperature feedback.

Images