Optical module package structure and making method thereof

Abstract

The invention discloses an optical module package structure which includes an adapter plate, an optical chip, a substrate, and an electrical interconnection structure. The adapter plate has a top surface, a bottom surface opposite to the top surface, a side surface connecting the top surface and the bottom surface, and a first through hole passing through the top surface and the bottom surface. There is a rewiring structure, one or more first pads, and one or more end pads on the top surface of the adapter plate, wherein, the one or more end pads are close to the side surface. The optical chip is mounted on the top surface of the adapter plate, and corresponds to the first through hole. The substrate has a rewiring layer, one or more second pads and one or more output pads on a first surface. The side surface of the adapter plate is fixedly installed on the first surface of the substrate. The electrical interconnection structure is used for electrically connecting the end pads to the second pads. Through vertical surface mounting of the adapter plate, the optical chip and an optical fiber are vertically interconnected, electrical signals can be transferred to the substrate, and vertical wiring is avoided.

Description

technical field [0001] The invention relates to the packaging field, in particular to an optical module packaging structure and a manufacturing method. Background technique [0002] With the popularity of optical communication and optical transmission, traditional micro-optical devices are being replaced by integrated optics and integrated optoelectronic devices. The trend of optical interconnection in the communication network industry is based on the balance between distance and data rate. As data rates have increased, fiber optics have replaced copper wires in the transmission of information over long distances because the higher speed signals experience little attenuation. It was this trend that inspired the concept of "fiber-to-chip," in which ultra-high-speed electrical signals between a microchip and the outside world are replaced by optical signals. The microchip still serves as the all-electric processing unit, and the optical fiber serves as the ultimate conduit ...

AI Technical Summary

Problems solved by technology

However, the current silicon-based photoelectric adapter boards and optical modules have complicated processing technology, poor process controllability, low processing yield, high requirements for wiring on the side wall of the silicon cavity, low wiring yield, and poor reliability.

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