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Chip package and manufacturing method thereof

A chip package and chip technology, which is applied to semiconductor devices, electrical solid-state devices, radiation control devices, etc., can solve the problems of increasing the size of semiconductor devices, reducing yield, and increasing the difficulty of semiconductor packaging.

Active Publication Date: 2019-12-13
XINTEC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above method will increase the difficulty of semiconductor packaging and reduce the yield rate, and will increase the volume size of the semiconductor device

Method used

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  • Chip package and manufacturing method thereof
  • Chip package and manufacturing method thereof
  • Chip package and manufacturing method thereof

Examples

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Embodiment Construction

[0036] The following disclosure provides many different embodiments or examples for implementing different features of the invention. The composition and layout of specific examples are described below to simplify the present invention. Of course these are examples only and are not intended to be limiting. For example, where it is stated that a first feature is formed on or over a second feature, then may include embodiments where the first and second features are formed in direct contact; and may also include embodiments, Where additional features can be formed between the first and second features so that the first and second features are not in direct contact. In addition, the present invention may repeat element numbers and / or characters in each example. The purpose of repetition is for simplicity and clarity, but not to determine relative relationships between the various embodiments and / or configurations discussed.

[0037] The singular terms mentioned below, unless o...

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Abstract

A chip package includes a sensing chip, a computing chip, and a protective layer annularly surrounding the sensing chip and the computing chip. The sensing chip has a first conductive pad, a sensing element, a first surface and a second surface opposite to each other. And the sensing element is disposed on the first surface. The computing chip has a second conductive pad and a computing element. The protective layer is formed by lamination and at least exposes the sensing element. The chip package further includes a conductive layer underneath the second surface of the sensing chip and extending to be in contact with the first conductive pad and the second conductive pad.

Description

technical field [0001] The invention relates to a chip package and a manufacturing method thereof. Background technique [0002] With the increase in demand for electronic or optoelectronic products such as digital cameras, digital video recorders, mobile phones, solar cells, screens and lighting equipment, semiconductor technology has developed rapidly, and The size of semiconductor chips tends to be miniaturized, and their functions become more complex. [0003] In the structure of the optoelectronic product mentioned above, the light sensing element plays an important role in the application of capturing images. These optoelectronic components are individually packaged into a chip package, and then electrically connected to the chip package with computing elements or control elements through an external conductive structure to form a complete semiconductor device. However, the above method will increase the difficulty of semiconductor packaging and reduce the yield, and...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146
CPCH01L27/14609H01L27/1462H01L27/14632H01L27/14685H01L27/14687H01L24/19H01L25/167H01L27/14618H01L31/0203H01L2224/04105H01L2224/12105H01L2224/24137H01L2224/73267H01L2924/14H01L2924/141H01L2924/143H01L2924/1461H01L2924/18162H01L2924/37001H01L23/5389
Inventor 关欣黄进清郑家明
Owner XINTEC INC