PCB impedance automatic test machine, and integrated structure of linear module and mounting pedestal of the same

A technology of mounting base and linear module, applied in the field of testing machine, can solve the problems of complex structure, high cost, and difficult processing of linear module and mounting base, and achieve low cost, reduced quality, and reduced processing difficulty. Effect

Pending Publication Date: 2017-11-24
JOINT STARS TECH
View PDF21 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defects of complex structure, difficult processing and high cost of linear modules and mounting bases in the prior art, thereby providing a linear module with simple structure, easy processing and low cost. Integrated structure of module and installation base

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB impedance automatic test machine, and integrated structure of linear module and mounting pedestal of the same
  • PCB impedance automatic test machine, and integrated structure of linear module and mounting pedestal of the same
  • PCB impedance automatic test machine, and integrated structure of linear module and mounting pedestal of the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as there is no conflict with each other.

[0036] Such as Figure 1-3 A specific embodiment of the integrated structure of the linear module and the installation base shown in , includes a U-shaped installation base 1 , including a bottom plate 11 and side plates 12 arranged along the two edges of the bottom plate 11 in the length direction. The side...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of a test machine, and specifically relates to an integrated structure of a linear module and a mounting pedestal. The integrated structure of a linear module and a mounting pedestal includes a U-shaped mounting pedestal (1) and a linear module, wherein the U-shaped mounting pedestal (1) includes a base plate (11) and two side plates (12) which are arranged along two edges of the length direction of the base plate (11); the linear module includes a driving structure (2) and two slide rails (3); the driving structure (2) and the two slide rails (3) are directly arranged on the U-shaped mounting pedestal (1); the two slide rails (3) are arranged at the top surface of the two side plates (12); and linear module also includes a slide piece (4) which makes a reciprocating linear movement on the slide rails (3). The invention provides an integrated structure of a linear module and a mounting pedestal, having the advantages of being simple in structure, being easy for processing, being low in cost, being small in the precise processing area of the base plate, and being able to reduce stress deformation caused by cutting heating to the greatest extent. The invention also provides a PCB impedance automatic test machine.

Description

technical field [0001] The invention relates to the technical field of testing machines, in particular to a PCB impedance automatic testing machine and an integrated structure of a linear module and a mounting base thereof. Background technique [0002] At present, the bases of most PCB impedance test products on the market are steel splicing or cast iron parts. The transmission part is a motor-driven single-axis module to realize the action mode. The base is the base for the installation of the transmission and drive parts. The base is Flat plate structure, install single-axis module on the plate to realize single-axis drive. However, the base has high requirements on precision, which makes the processing of the base more difficult, and it is easy to deform after processing and later use. In addition, because the lower surface of the single-axis module is in contact with the upper surface of the base, The accuracy of the base is limited by the accuracy of the module, and t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01R27/02H02K7/10
CPCH02K7/10G01R27/02
Inventor 杨海东成斌
Owner JOINT STARS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap