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Anisotropic link construct

An anisotropic and structural technology, which is applied in the manufacture of printed circuits, printed circuits connected with non-printed electrical components, printed circuits, etc. Achieving the effect of suppressing the rise in on-resistance

Active Publication Date: 2019-08-06
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the anisotropic connection structures employing the technologies disclosed in Patent Documents 1 to 4, the electrical connection (hereinafter, also referred to as anisotropic conductive connection) between the substrate and electronic components (driver IC, etc.) is likely to be caused by bending. become unstable
Therefore, in the anisotropic connection structures disclosed in the aforementioned Patent Documents 1 to 4, there is a problem that the on-resistance of the anisotropic conductive connection increases due to bending.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] First, a polyimide substrate (flexible substrate) having a film thickness of 0.3 mm on which Ti / Al electrodes having a height of 20 μm (the layout of the electrodes is the same as the bump layout of an IC chip described later) formed thereon was prepared. In addition, assuming that bending is performed with a bending diameter of 10000 μm in the X direction, an IC chip (electronic component) having a length of 25 mm in the X direction×2 mm in the Y direction and a thickness of 0.3 mm was prepared. Here, gold-plated bumps having a length of 25 μm in the X direction×50 μm in the Y direction and a height of 20 μm were formed on the IC chip.

[0089] Next, an anisotropic conductive film (CP6920F3 manufactured by Japan Dexerials Co., Ltd., with an average thickness of 25 μm and an average particle diameter of conductive particles of 3 μm) was pasted as an anisotropic conductive adhesive on the polyimide substrate formed with Ti / Al electrode face.

[0090] Next, the IC chip ...

Embodiment 2

[0092] An anisotropic connection structure according to Example 2 was produced in the same manner as in Example 1 except that an IC chip having gold-plated bumps formed with a length of 20 μm in the X direction×50 μm in length in the Y direction was used.

Embodiment 3

[0094] An IC chip formed with a gold-plated bump (70 μm in length in the X direction x 50 μm in length in the Y direction as a whole) having three convex portions of 20 μm in length in the X direction x 50 μm in length in the Y direction was used. The anisotropic bonded structure according to Example 3 was produced in the same manner as in Example 1 except that there was a groove (depth: 10 μm) between the X directions with a length of 5 μm.

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PUM

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Abstract

The present invention provides an anisotropic connection structure that suppresses an increase in conduction resistance due to bending. This anisotropic connection structure includes: a flexible substrate that can be bent; an electronic component that has bumps that face electrodes on the flexible substrate; and an anisotropic conductive adhesive that is sandwiched between the electrodes and the flexible substrate. Between the bumps, in the bumps, the length in the bending direction of the surface electrically connected to the electrode is 1 / 400 or less of the bending diameter of the flexible substrate.

Description

technical field [0001] The present invention relates to an anisotropic connection structure. Background technique [0002] In recent years, in semiconductor devices such as Liquid Crystal Displays and Organic ElectroLuminescence Displays, flexible and flexible substrates and electronic components are being studied to make the devices flexible. [0003] For example, the following patent documents 1 to 3 disclose display devices that improve the flexibility of the entire device by connecting a flexible substrate to a flexible driver IC (Integrated Circuit) using an anisotropic conductive film material. sex and softness. [0004] In addition, Patent Document 4 below discloses an anisotropic conductive adhesive in which the Young's modulus after curing is adjusted to a relatively easily deformable value by containing a plurality of predetermined resins. The anisotropic conductive adhesive disclosed in Patent Document 4 can also be elastically deformed flexibly against warpage ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/18H05K3/32
CPCH05K1/18H05K3/32H05K1/189H05K3/323
Inventor 江鳥康二平山坚一久保出裕美
Owner DEXERIALS CORP