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Wafer carrier and manufacturing method thereof

A manufacturing method and wafer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low production efficiency

Active Publication Date: 2018-07-03
新阳硅密(上海)半导体技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a wafer carrier and its production method

Method used

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  • Wafer carrier and manufacturing method thereof
  • Wafer carrier and manufacturing method thereof
  • Wafer carrier and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] The wafer processing equipment includes two manipulators. When the wafer processing equipment processes the wafers, the manipulators are required to place the carriers loaded with the wafers into the processing slots. Such as Figure 1-5 As shown, the wafer carrier includes a wafer chamber 10 , two side ear widening parts and leg pads.

[0063] Wafers are thin wafers such as figure 2 and image 3 As shown, the wafer 20 is loaded into the wafer chamber 10, and multiple wafers can be loaded. For the sake of simplicity, only one wafer is loaded in the figure. When processing, the two manipulators are controlled by the motion program, holding the The bottom surface of the two second side ears 303 on the left and right sides of the bracket 30 is lifted and moved, and put into the processing tank. After that, the manipulator separates from the wafer chamber 10 and the bracket 30, and the equipment starts to make the fluid flow through the wafer 20, and the fluid interacts ...

Embodiment 2

[0078] The structure of the carrier in this embodiment is basically the same as that of the carrier in Example 1, the only difference is that the arrangement of the side ear widening part and the leg pad height part is different. Specifically, in Embodiment 1, the widened portion of the side ear and the raised portion of the leg are realized by a bracket, and then the wafer magazine is erected on the bracket. However, in this embodiment, a plate is welded at the end of the first side ear away from the wafer chamber accommodating cavity as the widened part of the side ear, and a plate is welded at the bottom of the carrying body as the leg pad, and the welded plate can be welded. Some through holes or slots reduce weight.

[0079] The carrier in this embodiment is an integrated small wafer bin equivalent to a large wafer bin. The left and right ears of the small wafer bin are welded and widened to the same width as the width between the left and right ears of the large wafer bi...

Embodiment 3

[0081] The structure of the carrier in this embodiment is basically the same as that of the carrier in Example 1, the only difference is that the arrangement of the side ear widening part and the leg pad height part is different. Specifically, in Embodiment 1, the widened portion of the side ear and the raised portion of the leg are realized by a bracket, and then the wafer magazine is erected on the bracket. However, in this embodiment, if Figure 6 As shown, on the basis of the mold of the wafer carrier, the first side ear and the carrying body part are improved by adding side ear widening parts and leg pads, and then the wafer carrier is processed by injection molding.

[0082] In this embodiment, it is equivalent to redesigning the mold and manufacturing an integrated small wafer bin equivalent to a large wafer bin. The ears on the left and right sides are wider than the ordinary small wafer bins to be between the ears on the left and right sides of the large wafer bin. T...

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PUM

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Abstract

The invention discloses a wafer carrier and a manufacturing method therefor. By adoption of the carrier, equipment suitable for manufacturing wafers of single large diameters can be used for manufacturing wafers of multiple diameters. The carrier comprises a wafer cabin, two side ear widening parts and a leg heightening part; by virtue of the two side ear widening parts and the leg heightening part, the carrier can be equivalent to a wafer cabin which is matched with a corresponding mechanical arm on the aspects of width and height and can load wafers with relatively large diameters. Therefore, the carriers loaded with wafers can be taken, placed and moved without modifying a movement program of the mechanical arm; meanwhile, by virtue of the leg heightening part, the top parts of wafers of different diameters can be on the same horizontal plane, so that the generated manufacturing effects when wafer manufacturing fluid flows through wafers of different diameters can be consistent; and consequently, production efficiency and equipment utilization rate can be improved, adaptivity of the equipment is improved, purchasing of the same type of equipment can be avoided, and cost can be lowered. The manufacturing method for the wafer carrier is simple.

Description

technical field [0001] The invention relates to a wafer carrier and a manufacturing method thereof, which are used in wafer coating, glue removal, cleaning and etching processes. Background technique [0002] At present, the wafers used to produce circuit chips are of different sizes, and there are various diameters of wafers, such as 4 inches, 5 inches, 6 inches, 8 inches, 12 inches, 16 inches, 18 inches and so on. During wafer processing, multiple wafers are placed in the wafer chamber, and the wafer chamber is placed in the processing tank, so that the fluid flows through the wafers in the wafer chamber for processing. The fluid includes chemical liquid, gas, deionized pure water. [0003] In the prior art, wafer processing equipment is designed only for processing wafers with one diameter. If processing wafers with another diameter, it is necessary to adjust many parameters of the equipment, such as adjusting the movement program of the manipulator in the equipment, Ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673
CPCH01L21/673
Inventor 许峯嘉刘现营
Owner 新阳硅密(上海)半导体技术有限公司