Electromagnetic shielding package and manufacturing method
A technology of electromagnetic shielding and shielding body, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, circuits, etc. It can solve the problems of unfavorable heat dissipation, high cost, and complexity of plastic packaging layers, and achieve simple manufacturing, elimination of electromagnetic interference, and good electromagnetic The effect of isolation
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[0035] It should be noted that the components in the drawings may be exaggeratedly shown for illustration purposes, and not necessarily in correct proportions. In the drawings, the same reference numerals are assigned to the same or the same components.
[0036] Unless otherwise specified, in this application, the quantifiers "one" and "one" do not exclude scenarios with multiple elements.
[0037] figure 1 A schematic diagram of the first embodiment of the electromagnetic shielding package 100 according to the present invention is shown.
[0038] Such as figure 1 As shown, the electromagnetic shielding package 100 includes a substrate 104. The substrate 104 may be, for example, a common printed circuit board (PCB). The substrate 104 may include various conductive structures, such as interconnection lines 107 for connecting the chips 101a, 101b, and 101c, and a grounding line 105 for grounding the shield 102, or may also include vias (not shown). These conductive structures can be...
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