Optical module packaging structure and manufacturing method
A packaging structure and optical module technology, applied in optics, light guides, optical components, etc., can solve the problems of high wiring requirements on the side wall of the silicon cavity, complex processing technology, poor process controllability, etc., and achieve simple chip mounting process, Avoid the effect of vertical wire bonding and simple processing technology
Active Publication Date: 2019-12-31
NAT CENT FOR ADVANCED PACKAGING
View PDF3 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the current silicon-based photoelectric adapter boards and optical modules have complicated processing technology, poor process controllability, low processing yield, high requirements for wiring on the side wall of the silicon cavity, low wiring yield, and poor reliability.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0025] In the following description, the present invention is described with reference to various examples. One skilled in the art will recognize, however, that the various embodiments may be practiced without one or more of the specific details, or with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail so as not to obscure aspects of the various embodiments of the invention. Similarly, for purposes of explanation, specific quantities, materials and configurations are set forth in order to provide a thorough understanding of embodiments of the invention. However, the invention may be practiced without these specific details. Furthermore, it should be understood that the various embodiments shown in the drawings are illustrative representations and are not necessarily drawn to scale.
[0026] In this specification, reference to "one embodiment" or "the...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses an optical module packaging structure including a switching plate, an optical chip, and a flexible plate, the switching plate has a top surface, a bottom surface opposite to the top surface, and a first through hole penetrating the top surface and the bottom surface, and the top surface of the switching plate has a re-wiring structure and one or more first pads, the optical chip is arranged on the top surface of the switching plate and opposite to the first through hole, the flexible plate has a first surface, a second surface opposite to the first surface, a re-wiring layer and a second pad that are arranged on the first surface, a re-wiring layer and an output pad that are arranged on the second surface, a conductive through hole penetrating through the flexible plate to form the electrical connection between the first surface and the second surface, wherein the flexible plate can bend, and at least one first pad at the top of the switching plate is electrically connected to the second pad on the first surface of the flexible plate. According to the invention, the optical module socket is perpendicular to the chip through the flexible board, so that the vertical wiring can be prevented.
Description
technical field [0001] The invention relates to the packaging field, in particular to an optical module packaging structure and a manufacturing method. Background technique [0002] With the popularity of optical communication and optical transmission, traditional micro-optical devices are being replaced by integrated optics and integrated optoelectronic devices. The trend of optical interconnection in the communication network industry is based on the balance between distance and data rate. As data rates have increased, fiber optics have replaced copper wires in the transmission of information over long distances because the higher speed signals experience little attenuation. It was this trend that inspired the concept of "fiber-to-chip," in which ultra-high-speed electrical signals between a microchip and the outside world are replaced by optical signals. The microchip still serves as the all-electric processing unit, and the optical fiber serves as the ultimate conduit ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42
CPCG02B6/4281
Inventor 戴风伟张文奇
Owner NAT CENT FOR ADVANCED PACKAGING