Hot-cold double-effect floor temperature control system

Abstract

The invention relates to the field of indoor floors, in particular to a hot-cold double-effect floor temperature control system. The hot-cold double-effect floor temperature control system comprises a temperature control floor, an air conditioner, a temperature control pipeline, an air feeder, an exhaust fan and a controller. The temperature control floor comprises a surface floor layer formed by splicing a plurality of surface floor layer single bodies, and a bottom floor layer formed by splicing a plurality of bottom floor layer single bodies. Airflow pipelines are arranged in the bottom floor layer single bodies. Airflow outlets communicating with the airflow pipelines are formed in the tops of the bottom floor layer single bodies. The airflow pipelines between the adjacent bottom floor layer single bodies are connected through air seal connectors. Heat exchange faces facing the airflow outlets are arranged at the bottoms of the surface floor layer single bodies. Protruding heat exchange columns are arranged on the heat exchange faces. Heat exchange cavities are formed between the heat exchange faces and the tops of the bottom floor layer single bodies through the heat exchange columns. The air conditioner communicates with the airflow pipelines through the temperature control pipeline.

Description

technical field [0001] The invention relates to the field of indoor floors, in particular to a temperature control system for cold and hot double-effect floors. Background technique [0002] The traditional cooling and heating dual-effect floor mainly heats or cools the floor through heat pipes. For example, the application number is CN201310265108.9, which discloses an assembled floor for heating. The heat medium is introduced into the heat supply pipe in the floor to complete the heating of the floor. However, the problem with this heating mode is that the ground temperature around the heat pipe is relatively high. High, and the floor temperature between the heat pipes is low, so that the ground with different positions from the heat pipes has a relatively large temperature difference. The experience of the user walking barefoot on the floor is poor. In order to eliminate this temperature difference, conventional technical means usually adopt a method of increasing the a...

AI Technical Summary

Problems solved by technology

For example, the application number is CN201310265108.9, which discloses an assembled floor for heating. The heat medium is introduced into the heat supply pipe in the floor to complete the heating of the floor. However, the problem with this heating mode is that the ground temperature around the heat pipe is relatively high. High, and the floor temperature between the heat pipes is low, so that the ground with different positions from the heat pipes has a relatively large temperature difference

Poor experience for users walking barefoot on the floor

In order to eliminate this temperature difference, conventional technical means usually adopt the method of increasing the arrangement density of heat pipes, and this method greatly increases the production cost of the floor, and is also not conducive to the construction when laying the floor

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