Manufacturing method of single-sided light-emitting csp light source

Abstract

The invention discloses a single-sided light-emitting CSP light source, which comprises a light-emitting chip, a fluorescent glue layer, a light-transmitting glue layer and a white glue layer. The light-emitting chip is arranged under the fluorescent glue layer. The light-transmitting glue layer is arranged on the periphery of the light-emitting chip, and has a wide upper part and a narrow lower part. The white glue layer is arranged on the periphery of the light-transmitting glue layer. An interface of the light-transmitting glue layer and the white glue layer forms a tilt included angle with the side surface of the light-emitting chip. The manufacturing method of the single-sided light-emitting CSP light source comprises the steps of: arranging a fluorescent film on a substrate; arranging light-transmitting glue and light emitting chips in the middle of the light-transmitting glue on the fluorescent film; covering a separation film; placing an isolation mould between every two adjacent light-emitting chips to form a cavity, so that the light-transmitting glue is extruded into the cavity and cured; removing the isolation moulds and the separation film; filling white glue; and cutting the white glue to obtain the single-sided light-emitting CSP light source. The single-sided light-emitting CSP light source can reflect light of the light-emitting chips to the fluorescent glue layer and an emergent surface, prevents light from emitting from the lateral and bottom surfaces, and improves the utilization rate of light energy. The manufacturing method of the single-sided light-emitting CSP light source has the advantages of simple operation, simple steps, simple tools and low manufacturing cost.

Description

【Technical field】 [0001] The invention relates to the technical field of LEDs, in particular to a method for manufacturing a single-sided light-emitting CSP light source. 【Background technique】 [0002] The common single-sided light-emitting CSP (Chip Scale Package, light-emitting chip scale package) light source structure of the prior art, such as figure 1 As shown, it consists of a light-emitting chip 103 in the center, white glue 101 around the light-emitting chip 103, and a fluorescent layer 102 on the top; wherein, the light-emitting chip 103 is a light-emitting chip whose electrodes are located at the bottom of the light-emitting chip, so that welding wires can be omitted In the process, direct CSP solders the light source on the substrate through solder; the fluorescent layer 102 is formed by mixing transparent silica gel, fluorescent powder and auxiliary additives. The manufacturing method of the common single-sided CSP light source is to arrange the light-emitting ...

AI Technical Summary

Problems solved by technology

The white glue 101 of the single-sided CSP light source in the prior art blocks the side light emission of the light-emitting chip 103, and the brightness of the light source is reduced; at the same time, because the white glue 101 blocks the side light emission of the light-emitting chip 103, the light is reflected and refracted multiple times. The process light is converted into heat, which greatly increases the calorific value, reduces the reliability and safety of the light source, and shortens the life of the light source

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