Wafer transportation method, wafer transportation device and wafer transportation system

Abstract

The invention discloses a wafer transportation method, which comprises the steps of traversing the total thickness of wafers at each layer in a first wafer box, wherein the first wafer box comprises multiple layers, and at least one wafer is placed at each layer; determining a wafer with the total thickness being not greater than a first preset threshold to be a single wafer; and transferring thewafer at the layer determined to have a single wafer to a second wafer box. In addition, the invention further discloses a wafer transportation device and a wafer transportation system. According to the wafer transportation method disclosed by the invention, a code disc value of a motor is acquired through a position sensor, state information of a wafer is obtained before a grabbing arm of a manipulator, the detection time is short, the success rate is high, and problems such as wafer damages occurred during grabbing of the manipulator due to dislocation of wafers in the wafer box are avoided.Compared with a wafer transmission detection device in the past, the wafer transportation device performs judgment on the wafer state before transmission, greatly improves the transmission efficiencyof the wafers and greatly reduces the number of broken wafers.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a wafer transport method, a wafer transport device and a system. Background technique [0002] In the semiconductor industry, manipulators are usually used to transfer wafers between chambers or between stations to improve the accuracy of wafer pick-and-place. [0003] In the wafer transfer system, in order to avoid the occurrence of objective factors such as deviation or wafer damage when picking up the wafer, the existing technology only detects the wafer eccentricity, and how to ensure the smooth operation of the robotic arm during the grabbing process is often a problem. Regardless of whether the position and state of the wafer in the wafer box is misaligned, this is precisely the fatal point of wafer damage during the robot grabbing process. For example: In order to avoid the damage of the wafer during storage due to position deviation during the transfer process, th...

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Problems solved by technology

[0004] Although the above method is adopted, in the processing engineering of semiconductor wafers, wafers need to be frequently transferred between hundreds of processes, which often causes problems such as wafer misalignment during the wafer boxing process, causing the manipulator to grasp Wafer breakage or cracking during wafer pick-up, resulting in reduced productivity

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