A circuit board solder paste printer for preventing solder paste oxidation

A board solder paste and printing machine technology, which is applied in the field of circuit board solder paste printing machines, can solve problems such as oxidation, affecting the quality of printed circuit boards, and lack of solder paste, and achieve the effects of reducing solder shortage, improving efficiency, and ensuring supply

Active Publication Date: 2019-01-18
鹤山源昌电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the printing process, the problems of lack of soldering and solder paste oxidation are prone to affect the quality of printed circuit boards

Method used

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  • A circuit board solder paste printer for preventing solder paste oxidation
  • A circuit board solder paste printer for preventing solder paste oxidation
  • A circuit board solder paste printer for preventing solder paste oxidation

Examples

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Embodiment Construction

[0024] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0025] like Figure 1 to Figure 4 As shown, a circuit board solder paste printing machine for preventing solder paste oxidation according to the present invention is characterized in that it includes a base 1, a support 2, a cover plate 3, a back plate 4, a paste scraping module 5, and a transmission module 6 , a reversing module 7, a printing platform 8, a steel mesh 9 and a steel mesh frame 10, the base 1 is a cuboid, and a switch button 11 is installed in front of the base 1; the number of the supports 2 is two, and the supports 2 are installed on the base 1 on the upper surface, the support 2 is located on the right side of the base 1, and the side of the support 2 is provided with a vertical chute and a mounting hole; the cover plate 3 is ins...

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PUM

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Abstract

The invention relates to the field of surface mounting technologies and in particular discloses a circuit board solder paste printer for preventing solder paste oxidation. The circuit board solder paste printer comprises a base, a support, a cover plate, a back panel, a solder paste module, a transmission module, a reversing module, a printing platform, a steel mesh, a steel mesh rack and a scraper, wherein a switch button is arranged in front of the base; the support is arranged on the upper surface of the base; a vertical chute and a mounting hole are formed in the side face of the support;the cover plate is arranged on the top of the support; sliding pins are arranged on two sides of the back panel; the back panel moves up and down in the chute by the sliding pins; the solder paste module is used for scraping solder paste on the steel mesh; the transmission module is used for driving the solder paste module and the steel mesh to move to a printing position; the reversing module isused for controlling a reciprocating motion of the solder paste module; the printing platform is used for placing a circuit board and completing printing of the circuit board on the printing platform;and the steel mesh rack is used for fixing the steel mesh. According to the circuit board solder paste printer disclosed by the invention, oxidation of the solder paste in the printing process can beavoided, and solder leakage is reduced.

Description

technical field [0001] The invention relates to the field of surface mount technology SMT, in particular to a printed circuit board solder paste printing machine for preventing solder paste oxidation. Background technique [0002] With the development of science and technology, electronic products are more and more widely used in people's life. The large-scale production of electronic products drives the development of the circuit board production industry. Solder paste printing machines are used to print tin on the solder joints of circuit boards. The solder paste printing machine is an important executive mechanism in the SMT industry. It is responsible for accurately printing solder paste on the circuit board through the screen of the mold opening during the processing of the printed circuit board. In the printing process, the problems of lack of soldering and solder paste oxidation are prone to affect the quality of printed circuit boards. [0003] In view of this, a ci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41F15/08B41F15/40B41F15/46H05K3/12
Inventor 林春芳孙健苏杰
Owner 鹤山源昌电子科技有限公司
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