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Mini-sized bonding pad silicon-based PIN tube junction capacitance testing system and operation method therefor

A technology of a test system and operation method, applied in the direction of single semiconductor device testing, measuring device, measuring electrical variables, etc., can solve problems such as difficulty in accurately measuring the mesa PIN tube junction capacitance and bias voltage, weak electrical signals, and actual production problems of enterprises.

Pending Publication Date: 2018-01-16
NANJING HENGDIAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 2) The surface pad of the die is extremely small, generally about 28 μm to 100 μm, and the electrical signal provided by the micro-change of the test probe is extremely weak.
[0006] 3) Noise interference and stray capacitance both affect measurement accuracy
[0007] Therefore, in view of the limitations of hardware and measurement methods in the above prior art, it is difficult to accurately measure the relationship between the junction capacitance and bias voltage of the PIN tube on the table using the methods and hardware in the prior art, which brings great troubles to the actual production of enterprises.

Method used

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  • Mini-sized bonding pad silicon-based PIN tube junction capacitance testing system and operation method therefor
  • Mini-sized bonding pad silicon-based PIN tube junction capacitance testing system and operation method therefor
  • Mini-sized bonding pad silicon-based PIN tube junction capacitance testing system and operation method therefor

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Embodiment 1: as Figure 1-10 A test system for silicon-based PIN tube junction capacitance with miniature pads shown, the test system is placed on the workbench, and the test system includes: tester 7, probe positioning system, probe pressure adjustment system , probe positioning cross bar 21, microscope 3 and object stage 5, described probe positioning system includes X / Y axis motion system and Z axis motion system; Described microscope 3 is arranged on the top of object stage 5, The object table 5 is connected to the tester 7 through the test line 8 , and the probe 4 is arranged at one end of the probe positioning bar 21 .

[0041] The X / Y-axis motion system includes a horizontal adjustment rod 2, an adjustment block 14, a fixed block 11, a bearing 12 and a connection block 15. One end of the connection block 15 is connected to the probe positioning bar 21, and the other end is connected to the adjustment On the side of the block 14, the horizontal adjustment rod 2 ...

Embodiment 2

[0043] Embodiment 2: asfigure 1 , 2 As shown, the loading table 5 is provided with a sample-loading sheet 9, and a plurality of positioning holes 10 are evenly distributed on the sample-loading sheet 9, and the micro-pad silicon-based PIN tube is placed on the described sample-loading sheet; The diameter is Φ0.8mm;

Embodiment 3

[0044] Embodiment 3: as Figure 1-10 As shown, the probe pressure adjustment system is arranged on the probe positioning bar 21, and the probe pressure adjustment system includes a positioning fulcrum 24, a threaded rod 22 and a weight 6, and the weight 6 is movably installed on the threaded rod 22, the threaded rod 22 is installed in parallel on the upper part of the probe positioning bar 21 through two pillars 23; the probe pressure adjustment system and the probe 4 are respectively installed at both ends of the probe positioning bar 21 .

[0045] The positioning cross bar 21 and the positioning fulcrum 24 are a lever. The gravity at one end of the test probe is greater than the other end. When adjusting the vertical adjustment rod 1, the connecting block 15 does not form a support for the probe pressure adjustment system, and one end of the test probe is affected by gravity. Falling, by adjusting the weight 6 on the threaded rod 22, the gravity at both ends of the position...

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Abstract

The invention discloses a mini-sized bonding pad silicon-based PIN tube junction capacitance testing system and an operation method therefor. The testing system comprises a testing instrument, a probepositioning system, a probe pressure adjusting system, a probe positioning cross bar, a microscope and an objective table, wherein the probe positioning system comprises an X / Y axis movement system and a Z axis movement system, the microscope is arranged above the objective table, the objective table is connected on the testing instrument via a testing wire, one end of the probe positioning crossbar is provided with a probe, and the system disclosed in the invention is mainly used for screening tested PIN tubes; the system is simple in structure, easy in operation, low in cost and high in testing precision; a technical problem of how to test junction capacitance of a mini-sized bonding pad silicon-based PIN tube can be solved, and operation requirements of the tested PIN tubes in a radiofrequency circuit can be ensured.

Description

technical field [0001] The invention relates to the technical field of detection of silicon-based PIN tube junction capacitance, in particular to a testing system and operation method for silicon-based PIN tube junction capacitance of micro pads. Background technique [0002] The junction capacitance of the RF silicon-based PIN tube has a great influence on the electrical performance of the PIN tube. The junction capacitance not only affects the response speed of the switch and limiter PIN tube, but also affects the insertion loss of the PIN tube in the RF circuit. The relationship between capacitance and bias voltage is of great significance for the application of PIN tubes in radio frequency circuits. [0003] However, in the prior art, the methods for measuring the relationship between the mesa PIN tube junction capacitance and the bias voltage all have the following problems that need to be solved urgently: [0004] 1) Since the junction capacitance of the silicon-based...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R27/26G01R31/26
Inventor 董昌慧陈宁
Owner NANJING HENGDIAN ELECTRONICS