Laser round-cutting machine

Abstract

The invention provides a laser round-cutting machine. The laser round-cutting machine comprises a bottom box; a supporting platform is fixedly connected to the middle position of an inner cavity of the bottom box; a bidirectional motor is fixedly connected to the top of the supporting platform; first bevel gears are fixedly connected to the two sides of the bidirectional motor through couplings; second bevel gears are in engaged transmission with the surfaces of the first bevel gears; first threaded rods are fixedly connected to the sides, away from the first bevel gears, of the second bevel gears; a round cutting box is fixedly connected to the top of the bottom box; an object loading platform is arranged in the middle position of the top of the bottom box; flat plates are in threaded connection with the ends, away from the second bevel gears, of the first threaded rods; and clamping devices are fixedly connected to the top of the flat plates. The invention relates to the technical field of machinery. The current situations that an existing round cutting device is not ideal, low in efficiency, small in machining range and small in machining thickness, and safety problems are easyto occur during the machining process are solved; and data are set, so that fully-automatic operation of the round-cutting machine is achieved, manual operation during the whole process is not required, and personal safety is protected.

Description

technical field [0001] The invention relates to the field of mechanical technology, in particular to a laser circle cutting machine. Background technique [0002] At present, there are various cutting devices on the market, which are used in various occasions. Among them, most of the cutting devices used in the head industry have low work efficiency. Since the slices need to be processed in the initial production process of the head, the requirements for the cutting device are relatively high, and the cutting device currently used is in the processing circle. The processing accuracy has not been very ideal, and the outer circle of the processed wafer is uneven, with burrs and gaps, which requires further processing, which is time-consuming and labor-intensive. There are also some other problems with the currently used cutting devices, such as a small processing range and a small processing thickness. Therefore, it is an urgent problem to be solved to manufacture a cutting ...

AI Technical Summary

Problems solved by technology

[0003] Aiming at the deficiencies of the prior art, the present invention provides a laser circle cutting machine, which solves the problems of unsatisfactory precision, low work efficiency, small processing range, small processing thickness, and easy safety problems during the processing of the existing circle cutting device. status quo

Images