Mobile motherboard heat dissipation graphite sheet and mobile phone

Abstract

The present invention discloses a mobile motherboard heat dissipation graphite sheet. The sheet comprises a square-shaped heat-dissipating tube; a plurality of inner fins are symmetrically and uniformly distributed on two corresponding sides of the inner portion of the tube wall of the heat-dissipating tube; the inner fins are embedded in a graphite basal body; the heat-dissipating tube wraps thegraphite basal body; a plurality of external fins are symmetrically arranged on the other two opposite sides of the outer portion of the tube wall of the heat-dissipating tube; and the outer side of the tube wall of the heat-dissipating tube is uniformly coated with a spray layer. According to the mobile motherboard heat dissipation graphite sheet of the invention, aluminum alloy with high thermalconductivity is adopted; the inner wall and outer wall of the heat-dissipating tube are provided with the fins; the inner wall is in full contact with the graphite sheet, the heat dissipation area ofthe outer wall is large, and therefore, a heat dissipation rate can be greatly improved; and heat dissipation holes are formed in the graphite sheet, when the graphite sheet is bonded, air can be discharged easily through the heat dissipation holes, and therefore, air trapping can be avoided, the bonding quality of the graphite sheet and an electronic product is improved, and thus, the heat dissipation effect of the graphite sheet is improved, at the same time, assembly efficiency is improved, and production costs are reduced.

Description

technical field [0001] The invention relates to the technical field of mobile phone parts, in particular to a heat-dissipating graphite sheet for a main board of a mobile phone and a mobile phone. Background technique [0002] As electronic products such as mobile phones gradually turn to the development trend of thinner and lighter, the power consumption of chips is increasing, and the heat dissipation problem of electronic products is becoming more and more prominent. In order to improve the heat dissipation of electronic products, graphite sheets are widely used in the design of electronic products. The existing graphite sheet has a three-layer sandwich structure, which consists of graphite matrix, double-sided adhesive tape and release film from top to bottom. When assembling the graphite sheet, the release film is torn off first, and then the graphite sheet is pasted on the area of ​​the product to be dissipated. [0003] However, the existing graphite sheet structure...

AI Technical Summary

Problems solved by technology

[0003] However, the existing graphite sheet structure is prone to trapped air during the assembly process. Air is trapped between the graphite sheet and the electronic product, which reduces the bonding quality of the graphite sheet and leads to thermal contact resistance between the graphite sheet and the electronic product. increase, thereby reducing the heat dissipatio

Images