Manufacturing method of multilayer circuit board and multilayer circuit board

Abstract

Provided is a multi-layer circuit board, comprising a first base material layer in the inner layer of the multi-layer circuit board, a first conductive line layer and a second conductive line layer which are disposed at two opposite surfaces of the first base material layer, a third conductive line layer disposed at the surface of the first conductive line layer, and a fourth conductive line layerdisposed at the surface of the second conductive line layer. The multi-layer circuit board is provided with at least one first hole and a filling hole which is communicated with but not conductive with the first hole. At least one said first hole traverses through the third conductive line layer and / or at least one first hole traverses through the fourth conductive line layer. The filling hole traverses through the first conductive line layer and the first base material layer in an extending manner from the tail end of the first hole, and / or the filling hole traverses through the second conductive line layer and the first base material layer in an extending manner from the tail end of the first hole. The diameter of the first hole is larger than that of at least one filling hole. The filling hole is only conductive with the first conductive line layer and the second conductive line layer in an electrical manner.

Description

technical field [0001] The invention relates to a manufacturing method of a multilayer circuit board and a multilayer circuit board prepared by the manufacturing method. Background technique [0002] Consumer electronics products are becoming thinner, smaller and smarter. As an important component, circuit boards (FPC) are widely used in them, and the requirements for FPC production are getting higher and higher. In the prior art, for the manufacturing method of multi-layer circuit boards, it is generally first to provide a double-sided copper-clad substrate, to open holes or blind holes on the double-sided copper-clad substrate, and to perform copper plating on the entire surface of the double-sided copper-clad substrate or Selective plating makes the blind hole or through hole to form a conductive hole, and then makes the double-sided copper-clad substrate to form an inner layer conductive line. The conductive hole is used to make the inner layer conductive lines conduct w...

AI Technical Summary

Problems solved by technology

In the prior art, for the manufacturing method of multi-layer circuit boards, it is generally first to provide a double-sided copper-clad substrate, to open holes or blind holes on the double-sided copper-clad substrate, and to perform copper plating on the entire surface of the double-sided copper-clad substrate or Selective plating makes the blind hole or through hole to form a conductive hole, and then makes the double-sided copper-clad substrate to form an inner layer conductive line. The conductive hole is used to make the inner layer conductive lines conduct with each other. In this way, there will be the following problems: The full copper plating of the double-sided copper-clad substrate will increase the thickness of the final circuit board. If the copper-clad substrate is partially copper-plated, it will increase the risk of disconnection of the inner circuit layer and affect the quality of the formed multilayer circuit board.

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