Phase change heat exchanger used for high-performance computer

Abstract

The invention relates to a phase change heat exchanger used for a high-performance computer. The phase change heat exchanger is provided with a condenser shell, a condensation enhancement pipe is transversely arranged in the condenser shell, the left end and the right end of the condensation enhancement pipe are provided with a water inlet end cover and a water return end cover, a gaseous evaporation medium inlet is arranged at the position, above the condensation enhancement pipe, of the condenser shell, a subcooler is arranged at the bottom of the condenser shell, and is provided with a subcooler shell, multiple U-shaped supercooling pipes connected in an end-to-end manner are arranged in the subcooler shell, two water outlets hidden in the wall of the subcooler shell are formed in the upper end of the U-shaped supercooling pipe, the lower end of the U-shaped supercooling pipe is provided with two water inlets hidden in the bottom of the supercooler shell, a supercooling medium outlet is formed in the side wall of the supercooler shell, a liquid level detection instrument is arranged at the bottom in the condenser shell, and a protection liquid draining opening is formed in the side wall of the condenser shell. The heat exchanger is safer to use, and the cavitation effect on a pump can be effectively avoided.

Description

technical field [0001] The invention relates to the technical field of heat exchangers for electronic equipment, in particular to a phase-change heat exchanger for high-performance computers. Background technique [0002] As the functions of high-performance computers become more and more powerful, the comprehensive power of electronic components is getting higher and higher, and the heat generated is also increasing. The traditional air cooling and cold plate can no longer meet the requirements of use, and more requirements are put forward for the heat exchanger. high demands. In the high-performance computer, the electronic components are installed in the case and soaked in the liquid evaporation medium. When the high-performance computer is working, the electronic components generate a lot of heat, the liquid evaporation medium evaporates into a gaseous state, and the evaporated gaseous evaporation medium enters the condenser. After condensing, it enters the chassis agai...

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Problems solved by technology

[0002] As the functions of high-performance computers become more and more powerful, the comprehensive power of electronic components is getting higher and higher, and the heat generated is also increasing. The traditional air cooling and cold plate can no longer meet the requirements of use, and more requirements are put forward for the heat exchanger. high requirements

In the high-performance computer, the electronic components are installed in the case and soaked in the liquid evaporation medium. When the high-performance computer is working, the electronic components generate a lot of heat, the liquid evaporation medium evaporates into a gaseous state, and the evaporated gaseous evaporation medium enters the condenser. After condensing, it enters the chassis again through the pump. Since the pump generates heat during operation, the liquid evaporation medium evaporates in the pump after absorbing heat, and the gaseous evaporation medium has cavitation on the pump impeller, which endangers the use of the pump. At the same time, the high-performance computer belongs to Commercial products have very strict requirements on the overall space size, and the independent condenser and subcooler design cannot meet the use requirements; in addition, once the condensed water in the condenser leaks, it will cause serious damage to the electronic components in the chassis. influences

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