OLED device manufacturing method and corresponding OLED device

Abstract

An embodiment of the invention discloses an OLED device manufacturing method, which includes the steps of coating a glass substrate with a polyimide material to form a base substrate, the base substrate comprising a material with water oxygen absorption performance; preparing a TFT layer on the base substrate; preparing an OLED device layer on the TFT layer; preparing a thin film encapsulation layer on the OLED device layer so that the thin film encapsulation layer fully covers the OLED device layer; and peeling off the glass substrate from the base substrate, and attaching a protective layeronto a far side of the base substrate away from the TFT layer. The invention also discloses a corresponding OLED device. By implementing the embodiments of the invention, the water oxygen blocking performance of a PI layer in the OLED device can be improved, and the service life of the OLED device can be increased.

Description

technical field [0001] The invention relates to the display field, in particular to a manufacturing method of an OLED device and a corresponding OLED device. Background technique [0002] Organic Light Emitting Diode (OLED) display is a promising flat panel display technology, which has self-illumination, simple structure, ultra-thin, fast response, wide viewing angle, low power consumption and flexible display. and other characteristics. At present, OLED displays are favored by major display manufacturers, and have become the third generation of displays following CRT (Cathode Ray Tube) displays and Liquid Crystal Displays (Liquid Crystal Display, LCD). [0003] However, OLED is extremely sensitive to water and oxygen. Currently commonly used OLEDs often use top emission, so the requirements for water and oxygen resistance of TFE on the surface are extremely high. At present, many patents propose how to improve the water and oxygen resistance of the upper TFE. However, fo...

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Problems solved by technology

[0004] Flexible OLED has high requirements on the performance of the substrate. In order to meet the requirements of post-process preparation and product performance, OLED substrates are often required to have properties such as flexibility, bending resistance, and high temperature resistance. At present, in the OLED industry, because polyimide (Polyimide, PI) The film itself has the advantages of high temperature resistance (up to 400 ° C), small thermal expansion coefficient (< 10), etc., and is often selected as the substrate substrate of flexible OLEDs. However, the PI substrate has poor water and oxygen resistance, so external water vapor easily passes through PI. The substrate enters the inside of the OLED device, thereby shortening the lifetime of the OLED

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