Welding Chopping Knife

A technology of chopper and inclined surface, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of reducing the bondability of filaments and wires, poor peeling of joints, and poor peeling

Active Publication Date: 2020-05-19
TOTO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, the filament will be embedded in the thick plating layer, which may reduce the bondability between the filament and the lead wire
Also, after the second welding, the chopping property of the filament becomes worse
If the cuttability of the filament is deteriorated, there is a problem that the junction part peels off when the filament is cut (defective peeling)
Also, since the solder capillary is pressed against the rough plating, the solder capillary is prone to wear
There is a possibility that the life of the welding rivet will be reduced

Method used

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  • Welding Chopping Knife
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0055] figure 1 It is a schematic diagram illustrating the welding capillary according to this embodiment.

[0056] figure 2 It is a schematic enlarged view illustrating the tip shape of the welding capillary according to this embodiment.

[0057] figure 1 The welding capillary 110 as a whole is shown in . figure 2 is shown in the magnified figure 1 A diagram of area A is shown.

[0058] Such as figure 1 As shown, a welding capillary (hereinafter, sometimes referred to as “capillary”) 110 has a main body portion 10 . The main body portion 10 is a cylindrical member and has a through hole 20 . The through hole 20 is a through hole extending in the axial direction Da of the main body portion 10 . When using a riving knife, the thread passes through the through hole 20 .

[0059] The body part 10 is provided with: a cylindrical part 11 ; a conical part 12 provided on the front end side of the cylindrical part 11 ; and a bottle neck 13 provided on the front end side of ...

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Abstract

The invention provides a welding capillary, comprising a main body, having a through hole through which a filament passes through; a first pressing surface, configured to press the filament, provided around the through hole and extending relative to the through hole; The first inclined surface inclined in the direction in which it exists; and the second pressing surface, which presses the filament, has a tapered tapered surface provided between the first inclined surface and the through hole, and is provided on the The second inclined surface between the tapered surface and the first inclined surface is characterized in that the square mean square root slope of the roughness curve elements of the second inclined surface is smaller than the roughness curve of the first inclined surface The square mean square root slope of the features.

Description

technical field [0001] Aspects of the present invention generally relate to a welding capillary. Background technique [0002] In the manufacturing process of a semiconductor device, wire bonding is performed to connect a semiconductor element and a lead frame with a bonding wire (hereinafter referred to as "wire"). In wire bonding, one end of a filament is bonded to an electrode pad of a semiconductor element with a bonding capillary (first bonding). Next the filament is pulled and bonded to the lead (second soldering). When joining filaments, ultrasonic waves are applied while pressing the filaments with a welding capillary. [0003] For example, in the second soldering, the main bonding portion (stitch bonding portion) between the filament and the lead wire, and the temporary bonding portion (tail wire bonding portion) between the filament and the lead wire are formed. After such a second bond, the filament extending from the tail bond is severed (cut). Thereafter, th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L2224/45147H01L2224/78303H01L2224/78305H01L2924/00014H01L24/745H01L24/78H01L2224/78307
Inventor 冈总一郎大西惇平石塚祐司本村研一
Owner TOTO LTD
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