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PCB

A technology of metal blocks and heat dissipation holes, which is applied to printed circuit components, electrical components, printed circuits, etc., can solve the problems of poor heat dissipation performance of PCB, and achieve the effects of ensuring heat conduction performance, accelerating heat conduction performance, and enhancing heat dissipation performance

Inactive Publication Date: 2018-02-23
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a PCB, which can effectively solve the problem of poor heat dissipation performance of existing PCBs

Method used

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Embodiment 1

[0036] This embodiment provides a PCB. The PCB is formed by pressing three core boards, but the number is not limited thereto. For example, two or four core boards can also be formed by pressing together. Its structure is as Figure 1-Figure 3 As shown, components 3 are pasted on one side, and heat dissipation holes 5 and conduction holes 9 are opened. There are stepped grooves in the substrate 1 of the PCB, including smaller grooves and larger grooves, which form a convex shape. Ladder slot. A metal block 2 is buried inside the stepped groove, and the shape of the metal block 2 is the same as that of the stepped groove, both being convex. Wherein, the heat dissipation hole 5 is in the form of a blind hole, and the bottom of the blind hole extends to the metal block 2. In this embodiment, the heat dissipation hole 5 and the metal block 2 need to realize electrical conduction and heat conduction. The method adopted in this embodiment is to make the heat dissipation hole 5 met...

Embodiment 2

[0048] This embodiment provides a PCB. The PCB is formed by pressing three core boards, but the number is not limited thereto. For example, two or four core boards can also be formed by pressing together. For simplicity, only the differences between Embodiment 2 and Embodiment 1 are described. The difference is:

[0049] see Figure 4-Figure 6 , the heat dissipation hole 5 in this embodiment is in the form of a through hole, and the through hole is arranged through the metal block 2 and extends to the heat dissipation fin 7 . The setting of the through hole can increase the contact area with the metal block 2, and can conduct more heat to the metal block 2 quickly, and it is in contact with the heat sink 7, and the heat can be directly conducted to the metal block 2 through the copper layer on the inner wall of the through hole. The heat sink 7 performs dissipation.

[0050] The working principle of the second embodiment is described below:

[0051] Figure 5 It is a sche...

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Abstract

The invention relates to the technical field of PCB structures, discloses a PCB. The PCB includes a substrate, a metal block, and a heat dissipating hole; the substrate has a stepped groove; the metalblock is arranged in the stepped groove and same as the stepped groove in shape, and a heat conduction medium is arranged between the top surface of the metal block and a component; the heat dissipating hole is formed in the substrate, and the heat dissipating hole and the metal block can be used for heat conduction. By forming a groove in the PCB, embedding the metal block making direct contactwith the component and forming the heat dissipating hole which can be used for heat conduction with the metal block, heat generated by the component and heat in a metal layer in the PCB can be timelyand rapidly dissipated, the heat dissipation performance of the PCB is improved, and the service life of the PCB and the component is prolonged.

Description

technical field [0001] The invention relates to the technical field of PCB structures, in particular to a PCB. Background technique [0002] Printed circuit board (PCB for short) is the provider of electrical connection for electronic components. With the development of electronic product technology, the design of components on the PCB is becoming more and more obvious in the direction of surface mount, miniaturization and high density. The main frequency of components is continuously increasing, and the power consumption of individual components is gradually increasing. , leading to a sharp increase in heat flux. Therefore, in order to ensure the service life of electronic equipment, it is necessary to solve the problem of heat dissipation of high-power components. At present, the common heat dissipation structure can no longer meet the heat dissipation requirements of high-power components, so a fast heat dissipation structure is needed to realize effective heat dissipat...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH05K1/0204H05K2201/10416
Inventor 肖璐纪成光李民善王洪府
Owner DONGGUAN SHENGYI ELECTRONICS
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