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Power combiner with symmetrically arranged cooling bodies and power combiner arrangement

A power combiner and cooling body technology, which is applied to connection devices, waveguide-type devices, circuits, etc., can solve the problems of power combiner method and method change, large parasitic capacitance, etc.

Active Publication Date: 2021-01-12
TRUMPF HUETTINGER GMBH CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, since the electrical conductor is close to the cooling body, a parasitic capacitance is generated between the cooling body and the electrical conductor: the closer the electrical conductor is to the cooling body, the more efficient the cooling, but the greater the parasitic capacitance
Parasitic capacitances cause the characteristics of the power combiner to change in unfavorable ways and ways

Method used

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  • Power combiner with symmetrically arranged cooling bodies and power combiner arrangement
  • Power combiner with symmetrically arranged cooling bodies and power combiner arrangement
  • Power combiner with symmetrically arranged cooling bodies and power combiner arrangement

Examples

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Embodiment Construction

[0065] figure 1 A power combiner 10 is shown. The power combiner 10 has a first input 12 a for a first high-frequency signal and a second input 32 for a second high-frequency signal. The first input 12 a is connected to a first electrical conductor 14 . The second input 32 is connected to the second electrical conductor 16 . The electrical conductors 14, 16 are inductively and capacitively coupled to each other. A dielectric, in particular an electrically insulating substrate 18 , is arranged between the electrical conductors 14 , 16 .

[0066] More precisely, the power combiner 10 is formed in the present case by a circuit board with a dielectric, in particular an insulating substrate 18 , wherein a first capable Conductive layer 20 , on the second planar main side of the dielectric, in particular electrically insulating substrate 18 , is arranged a second electrically conductive layer 22 which extends parallel to the first electrically conductive layer.

[0067] The fir...

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PUM

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Abstract

The invention relates to a power combiner (10) with a cooling body (40). The power combiner (10) has at least one first electrical conductor (14) and a second electrical conductor (16). The first electrical conductor ( 14 ) and the second electrical conductor ( 16 ) are generally spaced apart from the heat sink ( 40 ) as equidistantly as possible. To this end, the first electrical conductor (14) and the second electrical conductor (16) are alternately arranged close to or remote from the heat sink (40). Alternatively or additionally, the cooling body (40) can be arranged between the first electrical conductor (14) and the second electrical conductor (16). Alternatively or additionally, the first electrical conductor (14) and the second electrical conductor (16) are divided as far as possible into parallel conductor segments (14a, 14b, 16a, 16b), wherein the conductor segments (14a, 14b, 16a, 16b) are spaced apart from the cooling body (40) in such a way that the first electrical conductor (14) and the second electrical conductor (16) are generally as close as possible to the cooling body (40) equally spaced.

Description

technical field [0001] The invention relates to a power combiner for coupling and / or distributing (splitting) high-frequency signals with a frequency greater than 1 MHz into an output power greater than 100 W. Furthermore, the invention relates to a power combiner device having such a power combiner. Background technique [0002] It is known to use power combiners with electrical conductors to combine multiple high-frequency signal sources and / or to distribute (splitting) one high-frequency signal. [0003] From EP 1 699 107 A1 a power combiner is known which has a second electrical conductor spaced apart from a first electrical conductor. The first electrical conductor is capacitively and inductively coupled with the second electrical conductor. According to EP 1 699 107 A1, in order to increase the inductive coupling between the two conductors, both the first electrical conductor and the second electrical conductor can have a plurality of windings. [0004] Other power ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P5/18
CPCH01P5/187H01P5/227H01P1/18H01P5/16
Inventor A·格雷德A·阿尔特D·格吕纳A·拉班茨
Owner TRUMPF HUETTINGER GMBH CO KG
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