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LED lamp and packaging method thereof

A technology of LED lamp and packaging method, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of uneven light output and low light output efficiency, and achieve uniform light output, high light output efficiency, and high light color consistency.

Pending Publication Date: 2018-03-06
SICHUAN SUNFOR LIGHT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the problems of low light output efficiency and uneven light output of existing LED lamps, the present invention provides an LED lamp on the one hand, the LED chip of the LED lamp is covered with a first glue-clearing layer A; the first glue-clearing layer A is covered with a first phosphor layer B

Method used

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  • LED lamp and packaging method thereof
  • LED lamp and packaging method thereof
  • LED lamp and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Such as figure 2 As shown, use the 1033 type flip chip 1, use a dispenser to cover a layer of silica gel on the chip 1 to form the first clear layer A2, and place the chip 1 covered with the silica gel layer in an oven at 150 ° C Take it out after baking for 3 hours. After the chip 1 containing the first clear glue layer A 2 drops to room temperature, use a dispenser to cover a layer of the first phosphor layer B 3, and then place the product in an oven to bake for 3 hours. Hours, the finished products are obtained, and the sample numbers are DJ-1, DJ-2, DJ-3, DJ-4, DJ-5 respectively.

Embodiment 2

[0034] Such as figure 2 As shown, use the 1033 type flip chip 1, use a laminator to cover a layer of silica gel on the chip 1 to form the first clear glue layer A2, and then use a laminator to cover a layer of the first phosphor layer B3, Then the product is placed in an oven and baked for 3 hours to obtain finished products, the sample numbers of which are YM-1, YM-2, YM-3, YM-4, YM-5 respectively.

Embodiment 3

[0042] Such as figure 2 As shown, use the 1033 flip chip 1, use a dispenser to cover a layer of silica gel on the chip 1 to form the first clear layer A2, and place the chip 1 covered with the silica gel layer in an oven at 150 ° C After baking for 3 hours, take it out, wait for the chip 1 containing the first glue-clearing layer A3 to drop to room temperature, then use a powder sprayer to cover a layer of phosphor powder, and then place the product in an oven and bake for 1 hour to obtain the finished product , the sample numbers are PF-1, PF-2, PF-3, PF-4, PF-5.

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Abstract

The invention discloses an LED lamp. A first clear adhesive layer A covers an LED chip of the LED lamp. A first phosphor powder layer B covers the first clear adhesive layer A. Compared with the priorart, the LED lamp provided by the invention has advantages of high light emitting-out efficiency, high light emitting-out uniformity and high color consistency of the emitted-out light. The inventionfurther discloses a packaging method of the LED lamp.

Description

technical field [0001] The invention relates to an LED lamp, in particular to the packaging of the LED lamp. Background technique [0002] In order to reduce the packaging volume, improve heat dissipation, improve uniformity, and improve chip reliability, the industry has traditionally defined CSP technology as a packaging component that has the same packaging volume as the LED chip, or is no larger than 20% of the LED chip, and has complete functions. , At present, the smallest CSP product is the packaging component of flip chip (Flip-Chip). [0003] Based on the current packaging process, high-power packaging is based on a thin film chip, which is then bonded to a ceramic substrate, and then coated with phosphor powder to form white light, while low- and medium-power packaging is mostly based on horizontal Chip-based, using a lead frame and requiring a wire-bonding process, or adopting a quad flat no-lead (QFN) package type, and then spraying phosphor. As shown in Figure...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/54H01L33/58H01L33/00
CPCH01L33/005H01L33/502H01L33/54H01L33/58H01L2933/0041H01L2933/005
Inventor 王森黄德忠
Owner SICHUAN SUNFOR LIGHT