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Tin-bismuth-lead ternary alloy solder composition using electroplating

A ternary alloy and composition technology, applied in electrical components, welding/cutting media/materials, electrodes, etc., can solve the problems of cracks, easy embrittlement, and expensive bismuth

Inactive Publication Date: 2018-03-09
HOJIN PLATECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the amount of the bismuth component is too large, it is prone to embrittlement and cracks
Also, bismuth is relatively expensive

Method used

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  • Tin-bismuth-lead ternary alloy solder composition using electroplating
  • Tin-bismuth-lead ternary alloy solder composition using electroplating
  • Tin-bismuth-lead ternary alloy solder composition using electroplating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A ternary alloy composition of 91.9% by weight tin, 5% by weight lead and 3.1% by weight bismuth. As a result of DSC measurement, the melting point ranged from 166.8°C to 220.6°C.

Embodiment 2

[0044]A ternary alloy composition of 93.1% by weight tin, 4.0% by weight lead and 2.9% by weight bismuth. As a result of DSC measurement, the melting point ranged from 167.6°C to 221.8°C.

Embodiment 3

[0046] A ternary alloy composition of 94.3% by weight tin, 3.0% by weight lead, and 2.7% by weight bismuth. As a result of DSC measurement, the melting point ranged from 166.4°C to 226.3°C.

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Abstract

The present invention relates to a Sn-Pb-Bi ternary alloy solder composition. In the present invention, since an amount of Bi is 5 wt% or less, and a melting point of the composition is determined in146-225 degree centigrade, soldering at a lower heating temperature than a common temperature is possible. Breaking phenomenon due to the inclusion of bismuth is not found.

Description

technical field [0001] The present invention relates to a solder composition, more particularly to a lead solder. Background technique [0002] Soldering is an interconnection technique by dissolving and placing solder between substrates and substrates, followed by heating. Welding is used in a variety of fields and in a variety of ways. In the field of solar cells, soldering technology is used in work for forming electrodes and in work for manufacturing solar cell modules by disposing and connecting substrates on which electrodes are formed. Even though various technological limitations arise in the commercialization of solar cells, efforts to ensure economic viability are important in addition to overcoming the technological limitations. Cost justification is ultimately an efficiency factor and a concomitant of technology. Industrial entities in this field face the challenge of simultaneously achieving better technology and greater economics. [0003] In manufacturing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C13/00C22C13/02C25D3/60B23K35/26
CPCB23K35/262C22C13/00C22C13/02C25D3/60B23K2101/36C25D17/10H01L31/0512Y02E10/50C25D3/56
Inventor 金判洙李德行郑运锡金珠英金钟彧
Owner HOJIN PLATECH
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