FPC (flexible printed circuit board) manufacturing method with covering layer manufactured through silk-screen printing and glue dispensing

Abstract

The invention discloses an FPC manufacturing method with a covering layer manufactured through silk-screen printing and glue dispensing. The method comprises the steps of S1, silk-screen printing including, covering uncovered areas through a silk-screen board to expose areas to be printed, ensuring that every edge of board patterns to be printed shrinks inwards 0.75-1.25 mm compared with designedpatterns to be printed, printing ink onto the areas to be printed of a copper foil base material through a silk-screen printing machine to form silk-screen printed patterns; S2, glue dispensing including dispensing glue onto glue dispensing areas of the copper foil base material through a glue dispenser to fill up missed parts between the silk-screen printed patterns and the designed patterns, andensuring that every edge of the glue dispensing areas expands 1.5 mm compared with the designed patterns; S3, baking including heating glue-dispensed FPCs at 160-180 DEG C for 10 min. The FPC manufacturing method with the covering layer manufactured through silk-screen printing and glue dispensing can directly reduce production processes of products, especially large-dimension products such as signal collecting FPCs of energy storage and electric vehicle battery packs, and meanwhile, can reduce dependency on large-top customized pressing machine tools and save costs of machine tool purchase,labor and time.

Description

Technical field [0001] The invention relates to the technical field of flexible printed circuits, in particular to an FPC manufacturing method for making a cover layer by screen printing and dispensing. Background technique [0002] At present, traditional FPC uses a cover film as a cover layer to protect electronic circuits, and the cover film needs to be cut out in advance, and then attached to the copper-based material, and then pressed and baked to combine the cover layer with the copper-based material. [0003] This process needs to go through 6 processes to complete (covering film cutting → drilling → punching → bonding copper substrate → pressing → baking). Moreover, when the product size is large (greater than 350mm*500mm), the conventional pressing production equipment needs to be processed in stages, which will directly generate quality risks and cause high labor costs. [0004] When custom-made large-table pressing equipment is used in the production of large-size product...

AI Technical Summary

Problems solved by technology

Moreover, when the product size is large (greater than 350mm*500mm), conventional lamination production equipment needs to be processed in batches, which will directly cause quality risks and lead to higher man-hour costs

[0004] When customized large-table lamination equipment is used for the production of large-scale products, the production cycle of customized equipment is long and the technical parameters are unstable, which will also lead to unstable quality of the produced FPC products (such as poor uniformity of cover layer thickness)