Copper alloy for electronic material and preparation method of copper alloy
A technology of electronic materials and copper alloys, which is applied in the field of copper alloys to achieve the effect of improving strength and electrical conductivity
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[0021] Correspondingly, the present invention also provides a method for preparing the copper alloy for electronic materials according to the above technical solution, which includes the following steps: according to the composition of the copper alloy, the alloy elements are melted in a high-frequency melting furnace at a temperature of 20°C / sec. Cast the alloy at a cooling rate of, and perform hot forging at 800°C with a deformation of 60%; heat the copper alloy after hot forging at 500°C for 3 hours, and then perform cold rolling with a deformation of 55%; at 380°C The temperature is kept for 6 hours, and then cold rolling with a deformation amount of 60% is performed; and the temperature is kept at 200° C. for 4 hours for stress relief annealing to obtain a copper alloy for electronic materials.
[0022] It can be seen from the above scheme that the present invention takes Ni, Cr, Mo, Ti, W, B, Ag, Sm, Gd and Cu as the main components, and each component interacts and influenc...
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[0025] Example 1
[0026] The composition of copper alloy for electronic materials is as follows:
[0027] Ni 0.5wt%, Cr 0.09wt%, Mo 0.04wt%, Ti 0.7wt%, W 0.05wt%, B 0.03wt%, Ag 0.6wt%, Sm 0.01wt%, Gd 0.05wt%, the balance being Cu.
[0028] According to the composition of the copper alloy, use a high-frequency melting furnace to melt the alloy elements, cast the alloy at a cooling rate of 20°C / sec, and perform hot forging at 800°C, with a deformation of 60%;
[0029] Keep the hot forged copper alloy at 500°C for 3 hours, and then perform cold rolling with a deformation of 55%;
[0030] Then keep it at 380°C for 6 hours, and then perform cold rolling with 60% deformation;
[0031] Keep the temperature at 200°C for 4 hours for stress relief annealing to obtain a copper alloy for electronic materials.
[0032] The performance of the copper alloy for electronic materials prepared in this embodiment was tested, and the tensile strength of the copper alloy was 860 MPa, and the electrical conduc...
Example Embodiment
[0033] Example 2
[0034] The composition of copper alloy for electronic materials is as follows:
[0035] Ni 0.9wt%, Cr 0.06wt%, Mo 0.08wt%, Ti 0.3wt%, W 0.1wt%, B 0.03wt%, Ag 0.2wt%, Sm 0.05wt%, Gd 0.01wt%, the balance being Cu.
[0036] According to the composition of the copper alloy, use a high-frequency melting furnace to melt the alloy elements, cast the alloy at a cooling rate of 20°C / sec, and perform hot forging at 800°C, with a deformation of 60%;
[0037] Keep the hot forged copper alloy at 500°C for 3 hours, and then perform cold rolling with a deformation of 55%;
[0038] Then keep it at 380°C for 6 hours, and then perform cold rolling with 60% deformation;
[0039] Keep the temperature at 200°C for 4 hours for stress relief annealing to obtain a copper alloy for electronic materials.
[0040] The performance of the copper alloy for electronic materials prepared in this embodiment was tested. The tensile strength of the copper alloy was 855 MPa, and the electrical conductivit...
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