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A method for reducing accompanying plate on vcp electroplating line

A technology of electroplating plates and accompanying plating plates, which is applied in the direction of electrolytic components, electrolytic processes, cells, etc., can solve the problems of reducing the use of accompanying plating plates, waste of resources, etc., and achieve the effect of saving production costs and reducing usage

Active Publication Date: 2019-04-02
高德(江苏)电子科技股份有限公司
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  • Description
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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that 12-14 accompanying plating plates are used to cause waste of resources during VCP production, and a method for reducing accompanying plating plates on the VCP electroplating line is provided. Current increases linearly, greatly reducing the use of spar plates

Method used

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Embodiment Construction

[0017] A method for reducing accompanying plate on the VCP electroplating line, comprising the steps of:

[0018] (1) Place the electroplated plate on the floating rack, place a piece of accompanying plate in front of the plated plate, and set 5-6 empty finger cots with insulating sleeves in front of the plated plate;

[0019] (2) Input the area of ​​a single electroplating plate, the speed at which the electroplating plate enters the electroplating tank, and the density of electroplating into the PLC through the keyboard input module;

[0020] (3) The PLC sends control commands to drive the servo motor to control the electroplating plate to enter the electroplating tank;

[0021] (4) The photoelectric sensor on the electroplating tank senses the number of electroplating plates entering the electroplating tank, and the encoder set on the electroplating tank is used to calculate the entering speed of the electroplating plate according to the speed and number of electroplating p...

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Abstract

The invention relates to a method for reducing plating accompanying plates of a VCP electroplating production line. A plating accompanying plate is arranged in front of an electroplated plate at first, the area of the single electroplated plate, the speed of the electroplated plate entering an electroplating cell and the electroplating density are input into a PLC through a keyboard input module,the PLC controls a servo motor to control the electroplated plate to enter the electroplating cell, when the plating accompanying plates in front of the electroplated plate starts entering the electroplating cell, the PLC sends a control command to drive a commutating machine to control the electroplating current of the electroplating cell, and the electroplating current is linearly increased until electroplating starts. By adding the programmable logic controller, the servo motor, the commutating machine, a photoelectric sensor and an encoder to the VCP electroplating production line, whereinthe servo motor, the commutating machine, the photoelectric sensor and the encoder are connected with the PLC, linear control over the electroplating current is achieved, traditional current increasing modes are changed, application of vertical and continuous plating accompanying plates is reduced, and the production cost is reduced.

Description

technical field [0001] The invention relates to a method for reducing accompanying plating plates on a VCP electroplating line, and belongs to the technical field of continuous electroplating production. Background technique [0002] Electroplating refers to a surface processing method in which the cations of the pre-plated metal in the plating solution are deposited on the surface of the base metal by electrolysis with the base metal to be plated as the cathode in a salt solution containing pre-plated metal to form a coating. , which is also a redox process. The basic process of electroplating is to immerse the part in a solution of metal salt as the cathode, and the metal plate as the anode, and then deposit the desired coating on the part after connecting to a DC power supply. [0003] With the increasingly fierce competition in the PCB industry, product prices continue to decline, and material costs continue to rise. It has become a trend to increase production capacity...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/12C25D7/00C25D17/08C25D17/00
CPCC25D7/00C25D17/00C25D17/08C25D21/12
Inventor 王文郭毅泰
Owner 高德(江苏)电子科技股份有限公司
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