Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Intelligent manufacturing technique for printed circuit board

A printed circuit board, intelligent manufacturing technology, applied in the direction of printed circuit manufacturing, printed circuit, program control, etc.

Active Publication Date: 2018-03-20
JIAN MANKUN TECH
View PDF14 Cites 26 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this does not mean that intelligent manufacturing has been realized, and a large number of production operators, quality inspection personnel, management personnel, etc. are required to complete the remaining work

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Intelligent manufacturing technique for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] A model order information: where 1PNL=4SET=8PCS, a PCB board raw material can be opened 4PNL.

[0082] (1) Storage of PCB board raw materials:

[0083] According to the delivery volume of A-type orders received by the marketing department, the ERP system automatically counts 25 required A-type PCB board raw materials, and forms a form and sends them to the purchasing department. After checking, the purchasing department purchases A-type PCB boards as needed. raw materials. A-type PCB board raw materials are shipped by suppliers to the PCB raw material inspection area of ​​the factory. The intelligent storage system automatically detects the quality of A-type PCB board raw materials. The purchased A-type PCB raw materials are stored on three-dimensional shelves according to the number required by the intelligent storage system, and the production information of the A-type PCB raw materials stored in the ERP system is input into the intelligent storage system; unqualifie...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an intelligent manufacturing technique for a printed circuit board, and the technique comprises the steps: PCB raw material warehousing, PCB raw material delivery, material splitting, inner layer, laminating, drilling, electroplating, outer circuit, welding, character, gold immersion, molding, electrical detection, final inspection, and packaging. The technique achieves theintelligent production from the PCB raw material warehousing, delivery, processing and packaging to delivery, enables all processes to be connected together, achieves the automatic linkage and regulation and control through a production control system, and achieves the automatic optimization of production parameters according to the testing conditions. An enterprise ERP system is connected, and the production arrangement is automatically carried out according to the delivery time of a customer. Cameras are respectively installed in key management and control regions of all processes, and theonline monitoring and remote monitoring can be achieved. All production information is enabled to automatically form a table, and is presented in a form of numbers. A production control system has functions of equipment automatic maintenance and management and fault automatic reporting.

Description

technical field [0001] The invention relates to a circuit board manufacturing process, in particular to a printed circuit board intelligent manufacturing process. Background technique [0002] Printed circuit boards are the provider of electrical connections for electronic components. With the continuous development of the industry, the amount of labor required by enterprises continues to increase. The problem of "labor shortage" is prominent, and it also increases the labor cost of enterprises. Following the introduction of the concept of "Industry 4.0" in Germany, my country has successively proposed the development strategy of "Made in China 2025" to support the continuous development of enterprises in the direction of higher automation, intelligence, informatization and digitalization, so as to reduce labor costs and improve Improve production efficiency and reduce the rate of defective products. [0003] At present, my country's printed circuit board production enterpri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G05B19/418H05K3/00
CPCG05B19/41865G05B2219/32252H05K3/00Y02P90/02Y02P90/60
Inventor 王小亮张孝斌肖学慧
Owner JIAN MANKUN TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products