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A kind of array substrate and its preparation method, display panel

A technology for array substrates and thin film transistors, which is applied in the manufacture of semiconductor/solid state devices, semiconductor devices, electrical components, etc.

Active Publication Date: 2020-06-05
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Embodiments of the present invention provide an array substrate and its preparation method, and a display panel, which can improve the problem that the performance of thin-film transistors produced later is affected due to the inhomogeneity of the film layer

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  • A kind of array substrate and its preparation method, display panel
  • A kind of array substrate and its preparation method, display panel
  • A kind of array substrate and its preparation method, display panel

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Embodiment Construction

[0049] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0050] An embodiment of the present invention provides an array substrate, such as Figure 1-4 As shown, it includes: a first thin film transistor 20 and a second thin film transistor 30 arranged side by side on the substrate 10; the first thin film transistor 20 includes a first insulating layer, and the first insulating layer includes a region corresponding to the second thin film transistor 30 In the first groove, the second thin film transistor 30 is locat...

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Abstract

Embodiments of the present invention provide an array substrate, a manufacturing method thereof, and a display panel, which relate to the field of display technology, and can prevent the performance of thin-film transistors produced later from being affected due to the inhomogeneity of the film layer. An array substrate, comprising: a first thin film transistor and a second thin film transistor arranged side by side on the substrate; the first thin film transistor includes a first insulating layer, and the first insulating layer corresponds to the second The area of ​​the thin film transistor includes a first groove, and the second thin film transistor is located in the first groove; wherein, the thickness of the first insulating layer at the bottom of the first groove is smaller than that of the first thin film transistor. region the thickness of the first insulating layer.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate, a preparation method thereof, and a display panel. Background technique [0002] In recent years, the technology of combining two types of thin film transistors has attracted much attention in the display industry, which can greatly improve the user experience of display products. [0003] However, in terms of process, the performance of the later-fabricated thin film transistor will be affected due to the influence of the uniformity of the insulating layer that has been formed. Contents of the invention [0004] Embodiments of the present invention provide an array substrate, a manufacturing method thereof, and a display panel, which can solve the problem that the performance of thin film transistors produced later is affected due to the inhomogeneity of the film layer. [0005] In order to achieve the above object, embodiments of the present inve...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/84
CPCH01L27/1248H01L27/1296H01L27/1251H01L27/1255H01L27/1225H01L27/1218H01L27/124H01L27/1262H01L29/7869H01L29/78675H01L29/66969H01L29/66757H10K59/124H10K59/131H10K59/1213H10K59/1216
Inventor 杨维胡合合卢鑫泓
Owner BOE TECH GRP CO LTD
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