Method for measuring adhesive discharge effect of electronic ceramic product

Abstract

The invention discloses a method for measuring an adhesive discharge effect of an electronic ceramic product. The method comprises the following steps of carrying out adhesive discharge on a standardelectronic ceramic product sample and to-be-measured electronic ceramic products, selecting three to four adhesive discharged to-be-measured electronic ceramic products as samples, carrying out three-point bending strength detection on one adhesive discharged to-be-measured electronic ceramic product and the standard electronic ceramic product sample, contrasting bending strength stress values ofthe three to four adhesive discharged to-be-measured electronic ceramic products with a bending strength stress value of the standard electronic ceramic product sample, carrying out fracture toughnessdetection on one adhesive discharged to-be-measured electronic ceramic product and the standard electronic ceramic product sample, and comparing fracture fissures of two products. According to the method, through the detection from the source of a material, the accuracy of the detection is improved; a mistake is avoided by multilevel comparison; the quality of the adhesive discharge detection ofan electronic product is improved, and the occurrence of the phenomenon that the production quality of the product is seriously poor caused by a manual observation error is avoided.

Description

technical field [0001] The invention relates to the technical field of gel removal measurement for electronic ceramic products, in particular to a method for measuring the gel removal effect of electronic ceramic products. Background technique [0002] Electronic ceramic products are generally composed of metal oxides. In order to make these metal oxides well bonded and compacted into bulk materials, it is usually necessary to add organic binders, dispersants, defoamers and lubricants to the mixture. Materials; in order to obtain electronic ceramic products with high sintering density, low porosity, uniform microstructure and excellent performance during the sintering process, the green body must be treated at low temperature to fully decompose these organic materials and discharge the green body, that is, the debinding process ; If these organic materials are not excluded and the electronic ceramic products are sintered directly, during the sintering process, these hydrocar...

AI Technical Summary

Problems solved by technology

[0002] Electronic ceramic products are generally composed of metal oxides. In order to make these metal oxides well bonded and compacted into bulk materials, it is usually necessary to add organic binders, dispersants, defoamers and lubricants to the mixture. Materials; in order to obtain electronic ceramic products with high sintering density, low porosity, uniform microstructure and excellent performance during the sintering process, the green body must be treated at low temperature to fully decompose these organic materials and discharge the green body, that is, the debinding process ; If these organic materials are not excluded and the electronic ceramic products are sintered directly, during the sintering process, these hydrocarbons will be carbonized due to insufficient time to decompose in the low temperature stage; these carbides will be oxidized into gases in the high temperature stage, making the product " "foaming" or increased closed pores, which will deteriorate the electrical performance of the product or cause scrapping. Therefore, whether the organic matter of the product is fully decomposed and eliminated is a very important quality control link; in actual production, generally by opening the product to observe whether the color of the section is consistent, If there is partial gray, burnt yellow or inconsistent color, it can be concluded that it has not been discharged completely; but when the residual amount is small, it becomes more difficult to detect the effect of adhesive removal by visual inspection

Images