Silicon chip underwater automatic taking and inserting machine

Abstract

The invention discloses a silicon chip underwater automatic taking and inserting machine capable of substituting the manual work to realize automatic inserting after silicon chip debonding. The silicon chip underwater automatic taking and inserting machine comprises a rack which is provided with an installing platform. The installing platform is provided with a flower basket conveying belt and a silicon chip conveying belt which are mutually parallel. One end of the rack is provided with a cleaning box, and the other end is provided with a vertical installing support. The cleaning box is internally provided with a silicon chip loading device. The vertical installing support is provided with a transverse slide device. A vertical flower basket clamping jaw is connected on the transverse slide device. The flower basket clamping jaw is connected with the transverse slide device through an elevating device. One end, which is arranged on the vertical installing support, of the installing platform is provided with a through hole. The through hole is exactly arranged below the flower basket clamping jaw and positioned on one end of the silicon chip conveying belt. The through hole is matched with the flower basket clamping jaw. With application of the silicon chip underwater automatic taking and inserting machine, automation can be realized, the cost can be reduced and the product quality can be enhanced.

Description

technical field [0001] The invention relates to the cleaning of silicon wafers, in particular to an automatic underwater wafer removal and insertion machine for silicon wafers. Background technique [0002] It is well known that after silicon rods are cut by diamond wire to form silicon wafers, degumming needs to be carried out. After the degumming is completed, the silicon wafers need to be divided into pieces, and then the pieces are inserted into flower baskets, and then subsequent cleaning and other processes are performed; in the prior art , the step of inserting the silicon wafers into the flower basket is basically done manually, so the operating workers are less efficient during the operation, and the operator is easily injured, the silicon wafers are easily damaged, and the silicon wafers are easily contaminated. [0003] In the prior art, such as Chinese patent application ZL201020515093.9, this utility model discloses a solar silicon wafer wet automatic slicing de...

AI Technical Summary

Problems solved by technology

[0004] Although the above-mentioned device can achieve the separation and transportation of stacked silicon wafers, its structure is complex and requires high installation accuracy between each device, especially the height of the two hydraulic nozzles and the inclination angle of the conveyor belt. If there is an error, in the process of slicing, it is easy to fail to realize slicing or missing pieces, which is not conducive to installation. At the same time, the structure is complicated and the manufacturing cost is high.

Secondly, the above-mentioned device cannot realize the insertion of silicon wafers, but can only achieve slices, so it cannot completely solve the full automation of removing and inserting silicon wafers after cleaning.

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