Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Machining method for high-strength intelligent bus card shell

A technology of a smart bus card and a processing method, applied in the field of mobile communications, can solve the problems of chip damage, being bent, easy to lose, etc., and achieve the effects of improving buffer protection, slowing down distortion, and preventing chip damage

Inactive Publication Date: 2018-04-27
范亦能
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When most passengers use bus IC cards, they usually carry them with them and put them in their trouser pockets or wallets for easy use; however, due to their small size and thin thickness, bus IC cards are easy to lose or be bent when carrying them. , which in turn causes the bus IC card shell to break and the chip in the card to be damaged

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Machining method for high-strength intelligent bus card shell

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Such as figure 1 As shown, this embodiment includes the following steps:

[0025] (A) forming an upper shell 1 and a lower shell 2 capable of engaging with each other by injection molding in a mold;

[0026] (B) Install filler 5 in lower case 2, and place chip 3 at the center of lower case 2;

[0027] (C) The upper casing 1 and the lower casing 2 are connected and matched by the rubber block 4, and then the upper casing 1 and the lower casing 2 are bonded and sealed by an adhesive.

[0028] In the above steps, the upper casing 1 and the lower casing 2 are connected to each other through rubber blocks 4 to form a closed cavity, and a chip 3 is fixed in the cavity, and a filler 5 is provided between the chip 3 and the cavity, Two elastic connecting portions 6 are provided on the outer walls of the upper casing 1 and the lower casing 2 respectively, and the width of the connecting portions 6 is 1 / 4 of the total width of the upper casing 1 . The work of the present inven...

Embodiment 2

[0031] Such as figure 1 As shown, in this embodiment, on the basis of Embodiment 1, the four connecting parts 6 are arranged symmetrically on the outer walls of the upper casing 1 and the lower casing 2 centering on the cavity. Four elastic connecting parts 6 are symmetrically distributed in pairs on the upper casing 1 and the lower casing 2. When the surface of the IC card is impacted by an external force, the elastic recovery of the connecting parts 6 can be superimposed to the maximum, and the direction is consistent with the direction of the external force. On the contrary, to the greatest extent offset the distortion caused by the external force acting on the card surface.

[0032] Preferably, the cross section of the connecting portion 6 is wavy. The connection portion 6 with a wavy cross section can generate a relatively large amount of deformation per unit area, which can further improve the buffer protection of the upper shell 1 and the lower shell 2 .

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a machining method for a high-strength intelligent bus card shell. The machining method comprises the following steps that A, injection molding is carried out in a mold, an upper shell and a lower shell which can be engaged are formed; B, the lower shell is internally provided with filler, and a chip is put at the center position of the lower shell; C, the upper shell and the lower shell are connected and coordinate with each other through a rubber block, and the upper shell and the lower shell and bonded and sealed through an adhesive. When an IC card is subjected to external force perpendicular to the card face or external force with which a certain angle is formed by the card face to deform, two elastic connection parts on the outer wall of the upper shell and the outer wall of the lower shell can deform in the direction of the external force so that distortion to the whole card face by the external force can be relieved, meanwhile, the rubber block located between the upper shell and the lower shell is stressed to compress, in the shape changing recovering process, the rubber block assists the elastic connection parts in reducing the distortion strengthto the card face by the external force to the minimum extent, and then the situation that the IC card is excessively distorted and the chip is damaged is prevented.

Description

technical field [0001] The invention relates to the field of mobile communication, in particular to a processing method for a high-strength smart bus card casing. Background technique [0002] IC card refers to integrated circuit card. The bus card we generally use is a kind of IC card. Generally, common IC cards use radio frequency technology to communicate with IC card readers. There is a difference between IC cards and magnetic cards. The card stores information through the integrated circuit in the card, while the magnetic card records information through the magnetic force in the card. The cost of the IC card is generally higher than that of the magnetic card, but the confidentiality is better. The bus IC card is a kind of non-contact data card, it is through the chip integrated in the card through the inductance coil on the card (the inductance coil is also a coil made of copper wire) at both ends of the coil through various The function of the circuit makes the induc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B29D99/00G06K19/077
CPCB29D99/006G06K19/07728
Inventor 范亦能
Owner 范亦能
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com