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Damage-free quick measurement method of high temperature contact thermal resistance

A technology of contact thermal resistance and measurement method, applied in the field of ultrasonic testing, can solve the problems that the measurement process is easily affected by various factors, the measurement accuracy is difficult to guarantee, and the formula derivation is complicated, etc., and achieves fast measurement speed, short measurement period, and low cost. Effect

Active Publication Date: 2018-04-27
CALCULATION AERODYNAMICS INST CHINA AERODYNAMICS RES & DEV CENT
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Problems solved by technology

Transient methods include laser photothermal measurement, thermal imaging, flash flash method, etc., which have the advantages of fast response, non-contact, and the size of the measurement sample can be as small as nanometers, but the measurement process is easily affected by various factors. Moreover, the derivation of the formula is relatively complicated, and the measurement accuracy is difficult to guarantee

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  • Damage-free quick measurement method of high temperature contact thermal resistance
  • Damage-free quick measurement method of high temperature contact thermal resistance
  • Damage-free quick measurement method of high temperature contact thermal resistance

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Embodiment Construction

[0025] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0026] Carry out the implementation of specific case according to technical scheme of the present invention and step, as follows:

[0027] m 1 One end of the tested piece is subjected to a flat heater T=550°C, and the rest of the surface is an insulating surface. The ultrasonic probe is placed at M 2 The upper end surface of the tested piece is excited with pulsed ultrasonic waves in the vertical incidence mode, based on the measurement of M 2 The change of echo propagation time in the test piece, by solving the thermal / acoustic coupling inverse problem, the inverse M 1 Test piece and M 2 The thermal contact resistance at the interface of the specimen.

[0028] Case1M 1 Test piece and M 2 The contact thermal resistance R of the specimen interface does not change with temperature, and the...

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Abstract

The invention discloses a damage-free quick measurement method of a high temperature contact thermal resistance. According to the medium temperature-ultrasonic propagation characters, ultrasonic propagation time under a transient heat transfer condition is acquired by means of an ultrasonic-echo method, and further the inverse problem of thermo-conduction is subjected to optimization solution, sothat the interface contact thermal resistance parameters, changing with temperature, are measured in a quick, damage-free and non-contact manner. The method only needs simple measurement devices and short measurement period, is free of contact between a sensor and a to-be-tested test piece, so that interference due to the contact between the sensor and the to-be-tested test piece and limitation onmeasurement range due to high temperature resistance of the sensor are avoided.

Description

technical field [0001] The invention relates to the field of ultrasonic testing, in particular to a non-destructive and rapid measurement method for high-temperature contact thermal resistance. Background technique [0002] In the analysis of structural heat transfer characteristics and heat protection design, contact thermal resistance is one of the important parameters, and the accuracy of its value is directly related to the quality of thermal control design. Too high or too low an estimate of the thermal resistance between the contact interfaces will affect the heat transfer of the structure, and in severe cases, it will lead to low efficiency of the structure or cause safety hazards. Therefore, the contact thermal resistance measurement at the interface has important application value in aerospace, machinery manufacturing, microelectronics, biomedicine, instrumentation and other fields. Contact thermal resistance is a nonlinear problem that is affected by many factors ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 魏东胡斌石友安杨肖峰肖光明刘磊杜雁霞桂业伟
Owner CALCULATION AERODYNAMICS INST CHINA AERODYNAMICS RES & DEV CENT
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