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FPC with heat dissipation structure and used for back light source

A technology of heat dissipation structure and backlight source, applied in optics, nonlinear optics, circuit thermal devices, etc., can solve the problems of not exerting the thermal conductivity of copper foil, affecting the heat dissipation performance of LED, and small pad area, so as to improve the utilization rate of light. , Improve the heat dissipation effect, increase the effect of the heat dissipation area

Inactive Publication Date: 2018-05-04
YANCHENG TIANSHUN MACHINERY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to the customary design method, in the existing FPC design, the line and pad are designed separately, the pad area is small, and the line width is narrow. The line is easy to break and cause open circuit

Method used

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  • FPC with heat dissipation structure and used for back light source
  • FPC with heat dissipation structure and used for back light source
  • FPC with heat dissipation structure and used for back light source

Examples

Experimental program
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Embodiment Construction

[0022] Such as Figure 2 to Figure 4 As shown, a kind of FPC with heat dissipation structure for backlight includes a substrate layer 1, a copper plating layer 2 is pasted on the substrate layer 1, a protective film layer 3 is arranged on the copper plating layer 2, and a protective film layer 3 is arranged on the copper plating layer 2. There are connecting lines 21 and several pairs of soldering pads 22 for soldering LEDs, and the soldering pads 22 penetrate upwards through the outer layer of the protective film layer 3 to the FPC. Welding pad 222, the first etching area 41 is arranged between the left welding pad 221 and the right welding pad 222; Copper layer 23; connecting circuit 21 comprises a first polarity circuit 211 and a second polarity circuit 212 opposite to the polarity of the first polarity circuit 211, between the first polarity circuit 211 and the second polarity circuit 212 There is a second etching area 42; the first polarity line 211 is connected to the l...

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PUM

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Abstract

The invention provides an FPC with a heat dissipation structure and used for a back light source. The FPC comprises a base material layer; the base material layer is provided with a copper plated layer; the copper plated layer is provided with a protection film layer; the copper plated layer is provided with bonding pads and a connecting circuit; each bonding pad pair comprises a left bonding padand a right boding pad corresponding to an LED welding pin; a first etching region is arranged between the left bonding pad and the right bonding pad; a first copper plated layer connected with the right bonding pads and the left bonding pads of adjacent two LEDs is arranged on the copper plated layer; the connecting circuit comprises a first polarized circuit and a second polarized circuit; a second etching region is arranged between the first polarized circuit and the second polarized circuit; the first polarized circuit is connected with the left bonding pad at the leftmost end; the secondpolarized circuit is connected with the right bonding pad at the rightmost end; a third etching region is arranged between the first polarized circuit and the first copper plated layer; and the firstcopper plated layer, the first polarized circuit and the second polarized circuit all extend to the outer edge of the FPC. By adoption of overall design of the circuit and the bonding pads, a large copper plating area and high heat dissipation performance can be achieved.

Description

technical field [0001] The invention belongs to the technical field of liquid crystal display, and in particular relates to an FPC for a backlight source with a heat dissipation structure. Background technique [0002] When designing backlight products using LEDs, attention must be paid to LEDs that may generate heat. The heat can be defined by the junction temperature. If the junction temperature is higher than the maximum value, it may cause significant brightness attenuation, and even cause damage due to disconnection. Other failures such as dead lights, in addition, reducing the junction temperature can prolong the life of the product. Based on the above reasons, heat dissipation design is very important when using LEDs. The existing backlight solders the LED on the FPC (flexible printed circuit board), such as figure 1 As shown, the pad on the FPC is connected to the solder pin of the LED, which mainly plays the role of circuit conduction. The basic process of FPC is...

Claims

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Application Information

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IPC IPC(8): H05K1/02H01L33/64H01L33/60G02F1/1333
CPCG02F1/133382G02F1/133628H01L33/60H01L33/641H01L33/647H05K1/0209
Inventor 王建坤
Owner YANCHENG TIANSHUN MACHINERY TECH CO LTD