A high performance heat dissipation flexible circuit board

Abstract

The invention discloses a high-performance heat-dissipating flexible circuit board. The circuit board includes a circuit board or an aluminum substrate; Together, the thickness of each polyimide layer is 18~35um, and the thickness of each copper foil is 12~75um; the aluminum substrate includes aluminum plate, polyimide layer and copper foil from bottom to top, and the thickness of the aluminum plate is 0.3~2.0 mm, the thickness of the polyimide layer is 35~70um, and the thickness of the copper foil is 12~75um; the polyimide layer includes the following components in mass percentage: 20~35% thermoplastic polyimide glue, 30~50% Aliphatic modified thermoplastic polyimide glue, 1~2% epoxy resin solution, 30~50% nano-alumina thermal conductive powder. The polyimide layer is used as an insulating layer, and its withstand voltage and flexibility are better than epoxy resin. The thickness of the insulating layer can be reduced to 35um under the same withstand voltage test conditions, and at the same time, it can improve the voltage breakdown problem in the bending fracture area of ​​the product .

Description

technical field [0001] The invention relates to the technical field of insulating materials, in particular to a high-performance heat dissipation flexible circuit board. Background technique [0002] At present, electronic products are becoming lighter and thinner, and the requirements for product performance are getting higher and higher, so the heat dissipation requirements of electronic products are becoming more and more stringent. Among the existing circuit boards, ordinary flexible circuit boards have not been able to find a good heat dissipation solution due to the poor heat dissipation performance of ordinary PI. In the traditional production process of aluminum substrates for LEDs, epoxy resin is used to add heat-conducting powder to make the insulating and heat-conducting layer between the aluminum plate and copper foil. Due to the voltage resistance of epoxy resin and the problem of easy fracture after bending, the current production The thickness of the insulati...

AI Technical Summary

Problems solved by technology

Among the existing circuit boards, ordinary flexible circuit boards have not been able to find a good heat dissipation solution due to the poor heat dissipation performance of ordinary PI.

In the traditional production process of aluminum substrates for LEDs, epoxy resin is used to add heat-conducting powder to make the insulating and heat-conducting layer between the aluminum plate and copper foil. Due to the voltage resistance of epoxy resin and the problem of easy fracture after bending, the current production The thickness of the insulating layer of the aluminum substrate is more than 100um

Images