A high performance heat dissipation flexible circuit board
A flexible circuit board, high-performance technology, applied in circuit substrate materials, printed circuits, printed circuits, etc., can solve the problems of flexible circuit boards failing to find heat dissipation solutions, fractures, poor heat dissipation performance, etc., to improve voltage breakdown problems, the effect of reducing reaction temperature, withstand voltage and flexibility
Active Publication Date: 2021-01-29
广东寅芯科技有限公司
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Problems solved by technology
Among the existing circuit boards, ordinary flexible circuit boards have not been able to find a good heat dissipation solution due to the poor heat dissipation performance of ordinary PI.
In the traditional production process of aluminum substrates for LEDs, epoxy resin is used to add heat-conducting powder to make the insulating and heat-conducting layer between the aluminum plate and copper foil. Due to the voltage resistance of epoxy resin and the problem of easy fracture after bending, the current production The thickness of the insulating layer of the aluminum substrate is more than 100um
Method used
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Embodiment Construction
[0019] The present invention will be further described below in conjunction with the examples, but it should be noted that the examples do not limit the protection scope of the present invention.
[0020] A high-performance heat dissipation flexible circuit board includes a circuit board or an aluminum substrate.
[0021] Among them, such as figure 1 As shown, the circuit board comprises two copper foils 1 coated with a polyimide layer 2 that are relatively laminated, wherein the polyimide layer 2 is relatively laminated and laminated, and the thickness of each polyimide layer 2 is 18~35um, the thickness of each copper foil 1 is 12~75um.
[0022] Such as figure 2 As shown, the aluminum substrate includes an aluminum plate 5, a polyimide layer 4, and a copper foil 3 from bottom to top. It is 12~75um.
[0023] The polyimide layers 2 and 4 include the following components in mass percentage: 20-35% thermoplastic polyimide glue, 30-50% aliphatic modified thermoplastic polyimi...
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Abstract
The invention discloses a high-performance heat-dissipating flexible circuit board. The circuit board includes a circuit board or an aluminum substrate; Together, the thickness of each polyimide layer is 18~35um, and the thickness of each copper foil is 12~75um; the aluminum substrate includes aluminum plate, polyimide layer and copper foil from bottom to top, and the thickness of the aluminum plate is 0.3~2.0 mm, the thickness of the polyimide layer is 35~70um, and the thickness of the copper foil is 12~75um; the polyimide layer includes the following components in mass percentage: 20~35% thermoplastic polyimide glue, 30~50% Aliphatic modified thermoplastic polyimide glue, 1~2% epoxy resin solution, 30~50% nano-alumina thermal conductive powder. The polyimide layer is used as an insulating layer, and its withstand voltage and flexibility are better than epoxy resin. The thickness of the insulating layer can be reduced to 35um under the same withstand voltage test conditions, and at the same time, it can improve the voltage breakdown problem in the bending fracture area of the product .
Description
technical field [0001] The invention relates to the technical field of insulating materials, in particular to a high-performance heat dissipation flexible circuit board. Background technique [0002] At present, electronic products are becoming lighter and thinner, and the requirements for product performance are getting higher and higher, so the heat dissipation requirements of electronic products are becoming more and more stringent. Among the existing circuit boards, ordinary flexible circuit boards have not been able to find a good heat dissipation solution due to the poor heat dissipation performance of ordinary PI. In the traditional production process of aluminum substrates for LEDs, epoxy resin is used to add heat-conducting powder to make the insulating and heat-conducting layer between the aluminum plate and copper foil. Due to the voltage resistance of epoxy resin and the problem of easy fracture after bending, the current production The thickness of the insulati...
Claims
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IPC IPC(8): H05K1/05B32B15/01B32B15/20B32B7/08B32B7/025B32B7/022B32B7/027B32B33/00
CPCB32B7/08B32B15/01B32B15/20B32B33/00B32B2255/06B32B2255/20B32B2255/26B32B2307/20B32B2307/206B32B2307/50B32B2457/08H05K1/056H05K2201/0154H05K2201/0338
Inventor 崔常鑫
Owner 广东寅芯科技有限公司