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Imidazole latent curing agent containing maleimide structure and preparing method of imidazole latent curing agent

A latent curing agent, maleimide technology, applied in the field of imidazole latent curing agents, can solve the problems of short pot life, high curing activity at room temperature, limited application, etc., to overcome the short pot life and extended storage period. , Improve the effect of storage period

Active Publication Date: 2018-05-08
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary imidazole curing agents have high curing activity at room temperature and short pot life, which limits their application in one-component epoxy resin systems

Method used

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  • Imidazole latent curing agent containing maleimide structure and preparing method of imidazole latent curing agent
  • Imidazole latent curing agent containing maleimide structure and preparing method of imidazole latent curing agent
  • Imidazole latent curing agent containing maleimide structure and preparing method of imidazole latent curing agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] The imidazole latent curing agent containing maleimide structure has the following molecular structure:

[0045]

[0046] Where R 1 And R 2 All are hydrogen, R 3 for n is 2.

[0047] The method for preparing the imidazole latent curing agent containing maleimide structure, the specific steps are as follows:

[0048] Mix 2.72g imidazole and 100ml N,N-dimethylformamide in the reaction flask uniformly, and then gradually add 7.16g 4,4'-bismaleimide diphenylmethane into the reaction flask under stirring conditions at 60°C ; After the addition of 4,4'-bismaleimide diphenylmethane, the reaction was stirred at 60°C for 4h; after the reaction, the solvent was removed by rotary evaporation to obtain the imidazoles with maleimide structure. Curing agent (code: A).

Embodiment 2

[0050] The imidazole latent curing agent containing maleimide structure has the following molecular structure:

[0051]

[0052] Where R 1 And R 2 All are hydrogen, R 3 for n is 1.

[0053] The method for preparing the imidazole latent curing agent containing maleimide structure, the specific steps are as follows:

[0054] Mix 2.72g imidazole and 100ml N,N-dimethylformamide in the reaction flask evenly, and then gradually add 7.56g N-(4-hydroxyphenyl)maleimide into the reaction flask under stirring conditions at 60℃ ; After the addition of N-(4-hydroxyphenyl) maleimide, the reaction was stirred at 60℃ for 3h; after the reaction, the solvent was removed by rotary evaporation to obtain the imidazoles with maleimide structure. Curing agent (No.: B).

Embodiment 3

[0056] The imidazole latent curing agent containing maleimide structure, its molecular structure is as follows:

[0057]

[0058] Where R 1 Is methyl, R 2 Is hydrogen, R 3 for n is 2.

[0059] The method for preparing the imidazole latent curing agent containing maleimide structure, the specific steps are as follows:

[0060] Mix 3.28g 2-methylimidazole and 100ml N,N-dimethylformamide in the reaction flask uniformly, and then gradually add 7.16g 4,4'-bismaleimide into the reaction flask under stirring conditions at 60°C Diphenylmethane; After the addition of 4,4'-bismaleimide diphenylmethane, the reaction was stirred at 70℃ for 4h; after the reaction, the solvent was removed by rotary evaporation to obtain imidazole containing maleimide structure. Class latent curing agent (code: C).

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PUM

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Abstract

The invention discloses an imidazole latent curing agent containing a maleimide structure and a preparing method of the imidazole latent curing agent. The molecular structure of the imidazole latent curing agent containing the maleimide structure is shown in the description. The synthesizing method comprises the following steps of uniformly mixing an imidazole compound containing active N-H bondsand a solvent in a reaction kettle, then stepwise adding raw materials of the compound containing the maleimide structure into the reaction kettle, and obtaining the imidazole latent curing agent containing the maleimide structure through an addition reaction. The storage period of a single component system constituted by the imidazole latent curing agent and epoxy resin is greatly prolonged, andepoxy resin can be quickly cured under a middle-and-high temperature condition.

Description

Technical field [0001] The invention relates to the technical field of epoxy resin latent curing agents and preparation methods thereof, in particular to a chemical modification method for preparing imidazole latent curing agents containing a maleimide structure. Background technique [0002] In recent years, epoxy resin latent curing agent is one of the hot spots in the research of epoxy resin curing agent at home and abroad. Compared with the two-component epoxy resin system commonly used at present, the one-component epoxy resin system prepared by mixing latent curing agent and epoxy resin has simple production and operation process, low environmental pollution, stable product quality, Convenient for large-scale industrial production and other advantages. [0003] Imidazole curing agents can initiate anionic chain polymerization of epoxy resins, and have the advantages of low dosage, high curing efficiency, chemical resistance of cured products, good mechanical properties and e...

Claims

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Application Information

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IPC IPC(8): C08G59/40
Inventor 杨爽胡业发章桥新周祖德丁国平王钧
Owner WUHAN UNIV OF TECH
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