Ultraviolet-curing adhesive with thermally induced self-healing property based on stepwise polymerization mechanism

Abstract

The invention provides an ultraviolet-curing pressure-sensitive adhesive with thermally induced self-healing property based on a stepwise polymerization mechanism. The thermally induced self-healing ultraviolet-curing pressure-sensitive adhesive is prepared from the following components in parts by mass: 50 to 150 parts of (methyl) acrylate random prepolymer, 0.5 to 5 parts of polyfunctional (methyl) acrylate crosslinking agent and 0.1 to 5 parts of photoinitiator, wherein the (methyl) acrylate random prepolymer is prepared from the following components in parts by mass: 40 to 100 parts of sticky monomer, 10 to 50 parts of cohesive monomer, 10 to 40 parts of functional monomer, 5 to 40 parts of rosin acrylate, 10 to 40 parts of blocked isocyanate acrylate and 0.1 to 0.5 part of photoinitiator. The synthesizing process of the ultraviolet-curing pressure-sensitive adhesive prepared by the invention is simple, energy consumption is low, active components are 100 percent, the ultraviolet-curing pressure-sensitive adhesive is environment-friendly, and more importantly, the ultraviolet-curing pressure-sensitive adhesive prepared by the invention has thermally induced self-healing property based on the stepwise polymerization mechanism.

Description

technical field [0001] The invention relates to a self-healing light-curing adhesive and a preparation method thereof, belonging to the technical field of light-curing materials. Background technique [0002] Polymer materials are susceptible to aging due to external light, heat, water, stress, chemical substances or the combined effects of these external factors during use, resulting in micro-cracks on the surface or inside. The existence of these micro-cracks makes the performance of the material And the service life is greatly reduced, and even catastrophic accidents may occur due to the expansion of microcracks. Self-healing polymer materials can realize the self-healing of the microcracks of the material itself by simulating the mechanism of biological damage healing, avoiding further damage and prolonging the service life of the material. Self-healing technology has shown good application prospects and application value in the field of microelectronics, biomedical mat...

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem that light-cured pressure-sensitive adhesives are prone to produce microscopic cracks and cause bonding failure in harsh environments, especially under the action of external stress, the present invention provides a thermally induced self-healing UV adhesive based on a gradual polymerization mechanism. Light-curing adhesives to achieve the purpose of solving the above problems

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