Magnetic suction type resin dissolving device

Abstract

The invention discloses a magnetic suction type resin dissolving device. The dissolving device comprises a dissolving kettle, a stirrer, a wet material inlet, a bulk material inlet and a fixing frame,wherein the fixing frame is used for fixing the whole dissolving kettle; an electromagnetic net is arranged at the bulk material inlet; the bulk material inlet and the wet material inlet are formed in two sides of the stirrer respectively; a heating wire is arranged on an inner wall of the dissolving kettle; before bulk materials enter the electromagnetic net, the bulk materials are dispersed through a dispersion device; the wet material inlet is formed in the dissolving kettle; multistage stirring blades are arranged on the stirrer. According to the magnetic suction type resin dissolving device disclosed by the invention, dry materials and the bulk materials are introduced, heated and stirred at the same time, and resin raw materials can be efficiently and rapidly heated and dissolved; the efficient magnetic suction type electromagnetic net is arranged so that metal particles in the bulk materials can be sufficiently adsorbed and a base plate raw material with better insulativity isobtained.

Description

technical field [0001] The invention relates to a magnetic suction type resin dissolving device, which belongs to the field of chemical raw material preparation. Background technique [0002] Printed circuit boards (PCB boards) and other electronic components integrated circuit boards usually use polymer materials as substrate materials. Polymer materials have light insulation, easy plasticity, waterproof, dustproof, anti-corrosion, low cost and environmental friendliness, so they have a very wide range of applications. use of space. However, during the preparation, the resin raw materials contain some fine metal particles. Once these metal particles are doped into the prepared substrate, it is very likely to affect the later preparation and performance of the metal plate. Especially for multi-layer composite printed circuit boards, the impact of metal particles on the entire circuit board will be particularly prominent, so it is necessary to completely remove the metal par...

AI Technical Summary

Problems solved by technology

[0003] In the existing resin dissolution preparation device, an electrostatic net is generally installed at the feed port to remove metal particles, but the effect of the electrostatic net on the removal of metal particles is not good, and the metal particles cannot be completely removed when adsorbed for a long time or when a large amount of material is fed, so Traditional resin adsorption equipment cannot meet the existing requirements for the dissolution and preparation of resin materials

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