Magnetic dielectric resin composition and applications thereof

A resin composition and magnetic medium technology, applied in the field of copper clad laminates, can solve the problems of poor insulation performance, flame retardant effect, poor mechanical strength, small magnetic permeability coverage, etc., and achieve good insulation, low dielectric loss, bending high intensity effect

Inactive Publication Date: 2019-04-02
SHAANXI SHENGYI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the above defects, the object of the present invention is to provide a magnetic dielectric resin composition and its application, which solves the problem of poo

Method used

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  • Magnetic dielectric resin composition and applications thereof
  • Magnetic dielectric resin composition and applications thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0032] The preparation method of magnetic and dielectric resin composition of the present invention is:

[0033] The resin is dissolved in a solvent, an initiator is added, and then a magnetic filler and a nonmagnetic filler are added, and mixed at room temperature to obtain a glue solution, that is, the magnetic and dielectric resin composition of the present invention.

[0034] The reinforcing material is impregnated with the above glue solution, and then baked in an oven at 155°C for 5 minutes to be cured to stage B to obtain a reinforcing material prepreg.

[0035] The produced prepreg is placed between copper foils, laminated and cured in a press at 210°C to obtain a cured product, and the dielectric constant, magnetic permeability, resistivity and other properties are measured.

[0036] The preparation process of the magnetic filler of the present invention is as follows: a certain proportion of zinc oxide, iron oxide, nickel oxide, magnesium oxide and other substances a...

Example Embodiment

[0047] Example 1

[0048] Dissolve 20g of brominated epoxy resin B, 10g of phenoxy resin C, and 25g of polyphenylene ether resin SA9000 in the solvent ethylene glycol methyl ether; then add magnetic filler, the type of magnetic filler is C-100, and the resistivity is 100Ω .M, a magnetic permeability of 1000, a particle size of 0.1uM, and an addition amount of 50g; mixed at room temperature to obtain a glue solution, that is, a magnetic-dielectric resin composition.

[0049] The reinforcing material is used to impregnate the above glue solution, and then baked in an oven at 155°C for 5 minutes to cure to stage B to obtain a reinforcing material prepreg. The produced prepreg is placed between copper foils, laminated and cured in a press at 210°C, and the dielectric constant, magnetic permeability, resistivity and other properties are measured after the copper clad laminate is obtained. The specific performance test results are shown in Table 2 .

Example Embodiment

[0050] Example 2

[0051] The difference between this example and Example 1 is that the preparation raw materials include: 27g epoxy resin A, 45g brominated epoxy resin B, 25g phenoxy resin C, the type of magnetic filler is C-500, and the resistivity is 500Ω.M , The magnetic permeability is 300, the particle size is 10uM, and the addition amount is 200g.

[0052] The magnetic and dielectric resin composition prepared in this example was used to prepare a copper clad laminate, and the properties of the prepared copper clad laminate are shown in Table 2.

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Abstract

The present invention discloses a magnetic dielectric resin composition, which comprises, by weight, 30-100 parts by weight of a resin, 50-500 parts by weight of a magnetic filler, 0.1-7 parts by weight of an initiator, and 0.1-7 parts by weight of an accelerator, wherein the magnetic filler has resistivity of 100-1000 [omega].M. According to the present invention, the magnetic dielectric resin composition is used for the preparation of prepregs, laminates, copper clad laminates or circuit boards; and through the synergistic effect among different components in the magnetic dielectric resin composition, the prepared copper clad laminate has advantages of high magnetic permeability, good insulation property, low dielectric loss and high bending strength.

Description

technical field [0001] The invention belongs to the technical field of copper clad laminates, and in particular relates to a magnetic and dielectric resin composition and its application. Background technique [0002] With the development of emerging micro-processing technologies such as microelectronics and micro-mechanics, in the trend of high-density mounting technology as the background, capacitors, integrated circuits, circuit modules, antenna radio frequency modules, etc. are constantly developing in the direction of miniaturization. Miniaturization, built-in, multi-band, and intelligence are the development trends of small antennas for mobile terminals. Patents CN103101252A and CN103351578A disclose a high dielectric constant plate, which can reduce the size of the antenna, but this method will reduce the gain of the antenna and reduce the overall performance of the antenna. [0003] Magnetic dielectric plates can be used as embedded inductors, and can also reduce th...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L63/00C08K3/22
CPCC08K2201/01C08L63/00C08L71/12C08K3/22
Inventor 殷卫峰吴成蛟李莎师剑英张济明
Owner SHAANXI SHENGYI TECH
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