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Heat spreader with optimized coefficient of thermal expansion and/or heat transfer

A technology of thermal expansion coefficient and thermal diffusion, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, lasers, etc., can solve problems such as high cost, unreliability, and excessive time

Active Publication Date: 2018-05-11
NLIGHT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These measures may be unreliable and implementing measures to reduce mechanical stress may take too much time and cost

Method used

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  • Heat spreader with optimized coefficient of thermal expansion and/or heat transfer
  • Heat spreader with optimized coefficient of thermal expansion and/or heat transfer
  • Heat spreader with optimized coefficient of thermal expansion and/or heat transfer

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Embodiment Construction

[0028] As used in this application and in the claims, the singular terms "a," "an," and "the" include the plural unless the context clearly dictates otherwise. Furthermore, the term "comprising" means "comprising". Furthermore, the term "coupled" does not exclude the presence of intervening elements between coupled items.

[0029]The systems, apparatus, and methods described herein should not be construed as limiting in any way. On the contrary, the present disclosure relates to all novel and non-obvious features and aspects of the various disclosed embodiments, individually and in various combinations and subcombinations with each other. The disclosed systems, methods, and apparatus are not limited to any particular aspect or feature, or combination thereof, nor do the disclosed systems, methods, and apparatus require any one or more particular advantages or problems to be solved. Any theory of operation is provided for ease of explanation, but the disclosed systems, method...

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Abstract

The invention discloses methods, systems and an apparatus relating to a heat spreader to be coupled to a heat source having a heat source coefficient of thermal expansion (HS CTE), the heat spreader comprising an anisotropic material having a high expansion axis. The heat spreader also including a surface to be coupled to the heat source, wherein the high expansion axis of the anisotropic materialis oblique to the surface of the heat spreader and wherein the high expansion axis of the anisotropic material is oriented at a first angle of rotation about a first axis of the heat spreader whereinthe first angle of rotation is selected to optimize a match of a first CTE of the heat spreader with the HS CTE.

Description

[0001] Cross-references to related patent applications [0002] This application claims the benefit of US Provisional Patent Application: 62 / 205,853, filed August 17, 2015, which is incorporated herein by reference for all purposes. technical field [0003] Generally, the field of technology disclosed herein is semiconductor packaging. More specifically, the disclosed techniques relate to matching the thermal expansion coefficient of the materials used in the package to the thermal expansion coefficient of the heat source. Background technique [0004] Semiconductor devices are fragile and are often assembled in packages to protect the device from damage due to thermal and mechanical stress, corrosion, contamination, and the like. Semiconductor packages typically include heat dissipating components, such as heat dissipating layers, heat spreaders, and / or heat sinks. [0005] A laser diode is a semiconductor device. In gallium arsenide (GaAs) and indium phosphide (InP) bas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01S3/04H01L21/02
CPCH01L23/36H01L23/373H01S5/02476
Inventor W·桑德斯M·坎斯卡
Owner NLIGHT INC