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Method for producing CAF-resistant copper clad board based on non-directional fiber material

A technology of fiber materials and copper clad laminates, applied in electrical components, manufacturing printed circuit precursors, printed circuit manufacturing, etc., can solve problems such as failure and leakage PCB, and achieve the effect of improving CAF resistance

Inactive Publication Date: 2018-05-15
金宝电子(铜陵)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the glass fiber cloth used is a long directional fiber, the drilling of this type of copper clad laminate will cause the glass fiber bundle to be loosened or separated during the PCB processing process, and the Gap or PTH process of the PCB will cause the chemical copper to immerse the glass fiber bundle to produce a wick effect ( Chemical copper Cu2+ ions move along the fiber from the positive electrode to the negative electrode), etc., resulting in CAF, resulting in leakage or PCB failure

Method used

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  • Method for producing CAF-resistant copper clad board based on non-directional fiber material
  • Method for producing CAF-resistant copper clad board based on non-directional fiber material
  • Method for producing CAF-resistant copper clad board based on non-directional fiber material

Examples

Experimental program
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Effect test

Embodiment 1

[0031] see Figure 1-2 Shown, the present invention is a kind of method for producing anti-CAF copper-clad laminate based on unoriented fiber material, comprises the steps:

[0032] Step 1, mixing epoxy resin, curing agent, curing accelerator and solvent to prepare resin liquid;

[0033] Step 2, impregnating non-oriented fiber paper, non-oriented fiber cloth or non-oriented fiber mat with the above resin solution, making it into a semi-cured state at a temperature of 145 ° C, and making a prepreg after drying;

[0034] Step 3, cutting the prepreg made above into a semi-finished prepreg of required size;

[0035] Step 4. According to the thickness requirement, superimpose 2 semi-finished prepregs to make fabric 2 of required thickness, and cover one side of fabric 2 with copper foil 1; at a temperature of 120°C and a pressure of 100kg / cm 2 And vacuum degree -60mmHg or less, thermoforming;

[0036] Step 5, use a cutter to cut off the leftover material of the hot-pressed coppe...

Embodiment 2

[0044] see figure 1 and 3 Shown, the present invention is a kind of method for producing anti-CAF copper-clad laminate based on unoriented fiber material, comprises the steps:

[0045] Step 1, mixing epoxy resin, curing agent, curing accelerator and solvent to prepare resin liquid;

[0046] Step 2, impregnating non-oriented fiber paper, non-oriented fiber cloth or non-oriented fiber mat with the above resin solution, making it into a semi-cured state at a temperature of 180 ° C, and making a prepreg after drying;

[0047] Step 3, cutting the prepreg made above into a semi-finished prepreg of required size;

[0048] Step 4. According to the thickness requirement, superimpose 6 semi-finished prepregs to make fabric 2 of required thickness, and coat copper foil 1 on both sides of fabric 2; at a temperature of 180°C and a pressure of 60kg / cm 2 And vacuum degree -60mmHg or less, thermoforming;

[0049] Step 5, use a cutter to cut off the leftover material of the hot-pressed cop...

Embodiment 3

[0057] see figure 1 and 4 Shown, the present invention is a kind of method for producing anti-CAF copper-clad laminate based on unoriented fiber material, comprises the steps:

[0058] Step 1, mixing epoxy resin, curing agent, curing accelerator and solvent to prepare resin liquid;

[0059] Step 2, impregnating non-oriented fiber paper, non-oriented fiber cloth or non-oriented fiber felt with the above resin solution, making it into a semi-cured state at a temperature of 205 ° C, and making a prepreg after drying;

[0060] Step 3, cutting the prepreg made above into a semi-finished prepreg of required size;

[0061] Step 4. According to the thickness requirements, stack 9 semi-finished prepregs to make a fabric 2 of the required thickness. An insulating layer 3 is provided between two adjacent fabrics 2, and copper foil is coated on the outer surface of the two adjacent fabrics 2. 1; At a temperature of 85°C and a pressure of 15kg / cm 2 And vacuum degree -60mmHg or less, th...

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Abstract

The invention discloses a method for producing a CAF-resistant copper clad board based on a non-directional fiber material and belongs to the copper clad board manufacturing technical field. The method comprises the following steps that: step 1, epoxy resin, a curing agent, a curing accelerator and a solvent are mixed so as to be prepared into a resin liquid; step 2, non-oriented fiber paper, non-directional fiber cloth or non-directional fiber felt is impregnated with the resin liquid, so that prepregs can be obtained; step 3, semi-finished prepregs are obtained by means of cutting; step 4, the semi-finished prepregs are superimposed so as to form a fabric, and one side or both sides of the fabric is or are covered with copper foil, and hot-press molding is performed; step 5, remnants ofthe corners of the copper clad board are cut off; and step 6, after being detected as a qualified copper clad board, the copper clad board is packaged and put into a warehouse. According to the methodof the invention, the non-oriented fiber paper, non-directional fiber cloth or non-directional fiber felt is adopted, and is impregnated with the epoxy resin liquid, obtained substances are dried, sothat the prepregs can be obtained; the prepregs are stacked, and one side or both sides of the fabric is or are covered with the copper foil, high-temperature pressing and curing are performed; and finally, the novel CAF-resistant copper clad board is obtained.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminate preparation, in particular to a method for producing CAF-resistant copper-clad laminates based on non-oriented fiber materials. Background technique [0002] Copper-clad laminates (referred to as "copper-clad laminates") are the basic profiles of the PCB industry. With the rapid development of the electronics industry, products are constantly advancing towards thinner and shorter. PCB lines are getting thinner, spacing is getting smaller, and insulation layers are getting smaller. The thinner the hole is, the more fine and dense the drilling is. On the other hand, the multi-function and multi-purpose of electronic products gradually require PCB to be better able to adapt to harsh working environments such as high temperature and high humidity. All these increase the Propensity for the formation of conductive cation transport (abbreviated as "CAF"). Therefore, how to better avoid the ...

Claims

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Application Information

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IPC IPC(8): H05K3/02
CPCH05K3/022
Inventor 胡金山汪晓霞
Owner 金宝电子(铜陵)有限公司
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