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Prepreg, laminated board and printed circuit board

A printed circuit board and prepreg technology, applied in the directions of printed circuits, circuit substrate materials, printed circuit components, etc., can solve the problem of insignificant ion migration resistance of the board, and achieve improved CAF resistance and high CAF resistance. performance effect

Active Publication Date: 2019-12-24
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Although the above two inventions can improve the ion migration resistance, they all use an ion scavenger in the resin composition, and the ion scavenger is evenly distributed in the entire resin matrix, and at the interface between the resin and the reinforcing material, the distribution The ion-scavenging agent obtained is only a very small part of the ion-scavenging agent added in the formula, and the ion-scavenging agent that can really be impregnated with the resin into the inner glass fiber yarn surface of the reinforcing material is even less. The ion migration CAF ( Conductive Anodic Filament) refers to the phenomenon that the copper wire dendrites grow along the surface of the glass fiber on the PCB board in a high-temperature and humid environment that is powered on for a long time. It can be seen that ion migration is a phenomenon that occurs on the surface of the reinforced material. As a result, only a small part of the ion trapping agents added in the formula can improve the ion migration resistance, most of the ion trapping agents do not play a role in actual use, and the overall improvement of the ion migration resistance of the board is not significant

Method used

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  • Prepreg, laminated board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] Multifunctional brominated epoxy resin XQ82937 (47.61wt%), phosphorus-containing phenolic resin KPH-L2005TMP (24.85wt%), four-functional epoxy resin EPON1031A70 (2.45wt%), imidazole accelerator 2E4MI (0.10wt%, 2E4MI produced by Japan Shikoku Chemical Industry) and silicon micropowder DS1032A (25wt%) are dissolved in propylene glycol methyl ether solvent, mechanically stirred and dispersed to prepare a glue solution with a solid content of 65wt%, and then use the glue solution to infiltrate the ion-scavenging agent IXEPLAS-A2 package Covered 7628 type glass fiber cloth (IXEPLAS-A2 accounted for 0.01wt% by weight of glass fiber cloth), and dried to obtain prepreg. Eight sheets of the prepreg were stacked between two sheets of copper foil and hot-pressed in a vacuum press to prepare a laminate. The laminates were prepared into test samples according to the requirements of the determination and evaluation methods, and the test results are shown in Table 1.

Embodiment 2

[0064] Multifunctional brominated epoxy resin XQ82937 (47.61wt%), phosphorus-containing phenolic resin KPH-L2005TMP (24.85wt%), four-functional epoxy resin EPON1031A70 (2.45wt%), imidazole accelerator 2E4MI (0.10wt%, 2E4MI produced by Japan Shikoku Chemical Industry) and silicon micropowder DS1032A (25wt%) are dissolved in propylene glycol methyl ether solvent, mechanically stirred and dispersed to prepare a glue solution with a solid content of 65wt%, and then use the glue solution to infiltrate the ion-scavenging agent IXEPLAS-A2 package Covered 7628 type glass fiber cloth (IXEPLAS-A2 accounted for 2wt% by weight of glass fiber cloth), and dried to obtain prepreg. Eight sheets of the prepreg were stacked between two sheets of copper foil and hot-pressed in a vacuum press to prepare a laminate. The laminates were prepared into test samples according to the requirements of the determination and evaluation methods, and the test results are shown in Table 1.

Embodiment 3

[0066] Multifunctional brominated epoxy resin XQ82937 (47.61wt%), phosphorous phenolic resin KPH-L2005TMP (24.85wt%), four-functional epoxy resin EPON1031A70 (2.45wt%), imidazole accelerator 2E4MI (0.10wt%) Dissolve silica powder DS1032A (25wt%) in propylene glycol methyl ether solvent, mechanically stir and disperse to prepare a glue solution with a solid content of 65wt%, and then use the glue solution to infiltrate the 7628-type glass fiber coated with ion trapping agent IXEPLAS-A2 Cloth (IXEPLAS-A2 accounted for 5wt% by weight of the glass fiber cloth) was dried to obtain a prepreg. Eight sheets of the prepreg were stacked between two sheets of copper foil and hot-pressed in a vacuum press to prepare a laminate. The laminates were prepared into test samples according to the requirements of the determination and evaluation methods, and the test results are shown in Table 1.

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Abstract

The invention provides a prepreg, a laminated board and a printed circuit board, wherein the surface of the reinforcing material in the prepreg is coated with the ion trapping agent layer, and the iontrapping agent attached to the surface can trap free impurity ions, so that copper ions are difficult to migrate along glass fiber yarns, and the ion migration resistance of the laminated board is remarkably improved.

Description

technical field [0001] The invention belongs to the technical field of laminated boards, and relates to a prepreg, a laminated board and a printed circuit board. Background technique [0002] With the rapid development of IC packaging technology, electronic products are developing towards high density, multi-function and "light, thin and small", which makes the assembly density and integration of components on the circuit board higher and higher, and the line spacing of the PCB board , The pore spacing is gradually reduced, and the resistance to ion migration is particularly important. [0003] Ion migration CAF (Conductive Anodic Filament) refers to the phenomenon that the copper wire dendrites grow along the surface of the glass fiber when the PCB board is powered on for a long time in a high-temperature and humid environment. The phenomenon of ion migration will lead to a short circuit on the PCB board, which will easily cause electrical fire and cause great harm. The e...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L61/34C08L79/04C08L71/12C08K9/10C08K7/00C08K7/14C08K3/36C08K13/06C08J5/24B32B15/08B32B15/20B32B27/06B32B27/18H05K1/03
CPCC08J5/24B32B15/20B32B27/18B32B27/06B32B15/08H05K1/0366H05K1/0373C08J2363/00C08J2379/04C08J2371/12C08J2361/34C08J2463/00C08K9/10C08K7/00C08K7/14C08K3/36C08K13/06B32B2457/08
Inventor 郝良鹏柴颂刚曾杰
Owner GUANGDONG SHENGYI SCI TECH
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