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Halogen-containing high-Tg high-speed copper-clad plate for communication server and preparation method thereof

A communication server, copper clad laminate technology, applied in chemical instruments and methods, layered products, metal layered products, etc., to achieve the effects of high heat resistance, low Dk, and low dielectric loss

Inactive Publication Date: 2022-04-05
江苏联鑫电子工业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is a lack of a copper-clad laminate substrate that can be applied to 5G technology and can meet the above requirements at the same time, which has become a research hotspot in the field of current copper-clad laminate research technology.

Method used

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  • Halogen-containing high-Tg high-speed copper-clad plate for communication server and preparation method thereof

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Experimental program
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Effect test

preparation example Construction

[0049] The above-mentioned resin glue is used to prepare the copper clad laminate, and the preparation method mainly includes the following steps:

[0050] S1, after weighing each component according to the composition of the above-mentioned resin glue, stir at 30-40°C for 6-10 hours;

[0051] S2, coating the resin glue solution prepared in step S1 on both sides of the glass fiber cloth, drying at 180-250°C for 2-4 minutes, and the prepared glass fiber cloth impregnated sheet is a prepreg ;

[0052] S3, according to the required thickness and shape of the final copper-clad laminate, take 1-8 sheets of the prepreg prepared in step S2 and stack them together and then cut them, and finally cover both sides with a layer of copper foil as the top copper foil After the layer and the bottom copper foil layer, hot press at -700~-730mmHg, 200~230°C for 180~300min, and naturally cool to room temperature to obtain the required copper clad laminate.

preparation specific Embodiment 1

[0054] S1, after weighing each component according to the composition of resin glue A, stir at 30°C for 8 hours;

[0055] S2, coating the resin glue solution A prepared in step S1 on both sides of the glass fiber cloth, drying at 190° C. for 3 minutes, and the prepared glass fiber cloth impregnated tablet is a prepreg;

[0056] S3, according to the required thickness and shape structure of the final copper-clad laminate, take 6 pieces of the prepreg prepared in step S2 and stack them together and then cut them, and finally cover both sides with a layer of 35 μm thick copper foil as the top copper foil After the layer and the bottom copper foil layer, hot press at -700mmHg, 210°C for 250min, and naturally cool to room temperature to obtain the required copper clad laminate.

preparation specific Embodiment 2

[0058] S1, after weighing each component according to the composition of resin glue B, stir at 35°C for 7 hours;

[0059] S2, coating the resin glue B prepared in step S1 on both sides of the glass fiber cloth, drying at 220° C. for 2 minutes, and the prepared glass fiber cloth impregnated tablet is a prepreg;

[0060] S3, according to the required thickness and shape structure of the final copper-clad laminate, take 6 pieces of the prepreg prepared in step S2 and stack them together and then cut them, and finally cover both sides with a layer of 35 μm thick copper foil as the top copper foil After the layer and the bottom copper foil layer, hot press at -710mmHg, 200°C for 200min, and naturally cool to room temperature to obtain the required copper clad laminate.

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Abstract

The invention discloses a halogen-containing high-Tg high-speed copper-clad plate for a communication server and a preparation method of the halogen-containing high-Tg high-speed copper-clad plate, and belongs to the technical field of 5G copper-clad plates and production processes thereof. The copper-clad plate comprises a bottom copper foil layer, a top copper foil layer and an insulating medium layer which is positioned between the bottom copper foil layer and the top copper foil layer and is formed by laminating 1-8 prepregs, and each prepreg is obtained by soaking glass fiber cloth in a resin glue solution and then drying, wherein the resin glue solution comprises styrene-maleic anhydride copolymer resin, tetrabromobisphenol A, cyanate ester, modified epoxy resin and silicon dioxide filler, and the modified epoxy resin is formed by mixing brominated epoxy resin, cresol formaldehyde epoxy resin, linear novolac epoxy resin and bisphenol A epoxy resin according to a specific proportion. The prepared copper-clad plate has the characteristics of high glass transition temperature, high heat resistance, low thermal expansion coefficient, low dielectric constant, low dielectric loss, good dimensional stability and the like.

Description

technical field [0001] The invention relates to a copper-clad laminate and a preparation method thereof, in particular to a halogen-containing high-Tg high-speed copper-clad laminate for a communication server and a preparation method thereof, belonging to the technical field of 5G copper-clad laminates and their production technology. Background technique [0002] In recent years, with the rapid development of global information technology towards digitization and networking, ultra-large-capacity information transmission, ultra-fast and ultra-high information processing have become the goals pursued by the development of information and communication equipment (ICT) technology. The realization of these goals poses unprecedented challenges to system design, terminal product processing, PCB, copper clad laminate, and copper foil manufacturing. High-speed PCB (High Speed ​​Digital PCB, referred to as HSD substrate) is a type of substrate for information and communication equip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/02B32B17/12B32B27/04B32B15/14B32B15/20B29C70/78C08J5/24C08L63/00C08L63/02C08L63/04C08L35/06C08L79/04C08K3/36
Inventor 陆波
Owner 江苏联鑫电子工业有限公司
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