Equipment safety monitoring system and method

Abstract

The invention reveals an equipment safety monitoring system and method. The system provided by the invention comprises an equipment setting module which is used for monitoring the abnormal motion of equipment; an equipment sampling module which is used for outputting a reference processing curve and a reference fitting degree value of the equipment, wherein the reference processing curve is combined with a real-time processing curve so as to obtain a real-time fitting degree value; executing the dynamic sampling operation according to the sizes of the reference fitting degree value and the real-time fitting degree value and an abnormal motion; a technological analysis module which is used for analyzing the abnormal motion of the equipment and providing an improved motion; and an equipmentimproving module which is used for combining with the improved motion to maintain the equipment according to the change of the dynamic sampling. Through the cooperation of the four parts, the system achieves the real-time feedback of information, avoids the hysteresis of the discovery of a fault of the equipment, and improves the utilization rate of the equipment.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an equipment safety monitoring system and method. Background technique [0002] Today's semiconductor manufacturing industry is developing more and more rapidly. With the various technological needs of customers, the complexity and diversity of the manufacturing process continue to increase, and the competitive pressure among enterprises is increasing. According to customer requirements, high-quality and efficient The production of semiconductors is getting more and more attention from the semiconductor manufacturing industry. In the case of a certain production cost and factory scale, adopting a more reasonable and effective equipment process monitoring method can better monitor the safety status of the equipment and improve the utilization efficiency of the equipment. [0003] The current monitoring method of equipment in the semiconductor manufacturing industry is gene...

AI Technical Summary

Problems solved by technology

However, there is a certain lag in this method, and it cannot reflect the safety status of the equipment in real time. If there is a hidden danger in the equipment, it will cause great losses during the detection period.

And separate personnel are required to operate, which will cause waste in manpower and material resources

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