Case heat dissipation device based on temperature sensor

Abstract

The invention discloses a case heat dissipation device based on a temperature sensor. The device comprises a case body and a cooling fan, wherein the cooling fan is arranged at the side face of the case body, the cooling fan is connected with a working motor, the working motor is connected with a microprocessor, the microprocessor is connected with the temperature sensor, the microprocessor is also connected with an AD conversion module, a wireless communication module and a buzzer, and the AD conversion module is connected with a display module; the temperature sensor collects a temperature signal inside the case body and sends the temperature signal to the microprocessor to complete analysis and processing; the microprocessor sends the processed temperature signal to the AD conversion module; the AD conversion module outputs temperature data to the display module; the microprocessor outputs a control signal to the working motor according to the processed temperature signal; and anti-collision sponges are arranged on external edges of the case body. The case heat dissipation device is simple in structure and low in production cost, has the function of observing the temperature inside the case body in real time and achieves the technical purpose that a user wirelessly controls the working state of the heat dissipation device in a short distance.

Description

technical field [0001] The invention relates to a cooling device for a computer case, in particular to a cooling device for the case based on a temperature sensor. Background technique [0002] Looking at the history of personal computer development, the chassis has been quietly growing behind the hardware stage throughout the hardware development process. Although its development speed is much slower than other major hardware, it has also experienced several major changes. And every change is to adapt to Intel's new system architecture, and to adapt to the ever-changing main hardware, such as CPU, motherboard, graphics card and the like. From the AT frame chassis to the ATX frame chassis, to the BTX frame chassis that Intel introduced later but failed to promote, to the very popular 38-degree chassis today, the internal layout is more reasonable, the heat dissipation effect is better, and more user-friendly. Design, undoubtedly brings a better home to the PC. The change o...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is that the existing computer case does not have the function of being able to observe the temperature inside the case in real time, and the working state of the cooling device cannot be adjusted according to the real-time temperature inside the case. The purpose is to provide a case cooling device based on a temperature sensor, Solve the problem that the existing computer case does not have the function of observing the temperature inside the case in real time, and cannot adjust the working state of the cooling device according to the real-time temperature inside the case

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